Datasheet HMC383 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHz |
| Páginas / Página | 6 / 4 — HMC383. GaAs PHEMT MMIC MEDIUM. POWER AMPLIFIER, 12 - 30 GHz. Absolute … |
| Formato / tamaño de archivo | PDF / 355 Kb |
| Idioma del documento | Inglés |
HMC383. GaAs PHEMT MMIC MEDIUM. POWER AMPLIFIER, 12 - 30 GHz. Absolute Maximum Ratings. Typical Supply Current vs. Vdd
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HMC383
v02.0907
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +5.5 Vdc Vdd (V) Idd (mA) RF Input Power (RFIN)(Vdd = +5.0 Vdc) +10 dBm +4.5 100 Channel Temperature 175 °C +5.0 101 Continuous Pdiss (T= 85 °C) +5.5 102 0.89 W (derate 9.9 mW/°C above 85 °C) Note: Amplifi er will operate over full voltage ranges shown above 3 Thermal Resistance 101.0 °C/W (channel to die bottom) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE IP Operating Temperature -55 to +85 °C OBSERVE HANDLING PRECAUTIONS H ESD Sensitivity (HBM) Class 1A S - C
Outline Drawing
R IE IF L P M R A E W O R & P A E IN L NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” Standard Alternate 3. TYPICAL BOND PAD IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD GP-2 (Gel Pack) [2] 5. BOND PAD METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 6. BACKSIDE METAL IS GROUND. packaging dimensions. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Hittite 8. OVERALL DIE SIZE ± .002 Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
3 - 5
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
v02.0907
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +5.5 Vdc Vdd (V) Idd (mA) RF Input Power (RFIN)(Vdd = +5.0 Vdc) +10 dBm +4.5 100 Channel Temperature 175 °C +5.0 101 Continuous Pdiss (T= 85 °C) +5.5 102 0.89 W (derate 9.9 mW/°C above 85 °C) Note: Amplifi er will operate over full voltage ranges shown above 3 Thermal Resistance 101.0 °C/W (channel to die bottom) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE IP Operating Temperature -55 to +85 °C OBSERVE HANDLING PRECAUTIONS H ESD Sensitivity (HBM) Class 1A S - C
Outline Drawing
R IE IF L P M R A E W O R & P A E IN L NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” Standard Alternate 3. TYPICAL BOND PAD IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD GP-2 (Gel Pack) [2] 5. BOND PAD METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 6. BACKSIDE METAL IS GROUND. packaging dimensions. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Hittite 8. OVERALL DIE SIZE ± .002 Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
3 - 5
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D