Datasheet HMC-AUH256 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | GaAs HEMT MMIC DRIVER AMPLIFIER, 17.5 -41.0 GHz |
| Páginas / Página | 6 / 4 — HMC-AUH256. GaAs HEMT MMIC DRIVER. AMPLIFIER, 17.5 - 41.0 GHz. Outline … |
| Formato / tamaño de archivo | PDF / 425 Kb |
| Idioma del documento | Inglés |
HMC-AUH256. GaAs HEMT MMIC DRIVER. AMPLIFIER, 17.5 - 41.0 GHz. Outline Drawing. Die Packaging Information. 2 - 69
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HMC-AUH256
v01.0208
GaAs HEMT MMIC DRIVER AMPLIFIER, 17.5 - 41.0 GHz Outline Drawing
2 IP H - C S R IE IF L P M K A OC BL IN A & G R E NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. IV 2. TYPICAL BOND PAD IS .004” SQUARE. R 3. BACKSIDE METALLIZATION: GOLD. D 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002”
Die Packaging Information
[1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
2 - 69
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
v01.0208
GaAs HEMT MMIC DRIVER AMPLIFIER, 17.5 - 41.0 GHz Outline Drawing
2 IP H - C S R IE IF L P M K A OC BL IN A & G R E NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. IV 2. TYPICAL BOND PAD IS .004” SQUARE. R 3. BACKSIDE METALLIZATION: GOLD. D 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002”
Die Packaging Information
[1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
2 - 69
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D