Datasheet ADL5324 (Analog Devices) - 6

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ADL5324 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Table 4 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VSUP 6.5 V junction-to-paddle thermal resistance (θJC) for the ADL5324. Input Power (50 Ω Impedance) 20 dBm
Table 4. Thermal Resistance
Internal Power Dissipation (Paddle Soldered) 1.9 W
Package Type θ 1 θ 2 Unit JA JC
Maximum Junction Temperature 150°C 3-Lead SOT-89 37 9 °C/W Operating Temperature Range −40°C to +105°C 1 Storage Temperature Range −65°C to +150°C Measured on Analog Devices evaluation board. For more information about board layout, see the Soldering Information and Recommended PCB Land Stresses above those listed under Absolute Maximum Ratings Pattern section. may cause permanent damage to the device. This is a stress 2Based on simulation with JEDEC standard JESD51. rating only; functional operation of the device at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 6 of 20 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide