Datasheet HMC7543 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 71 GHz to 76 GHz, E-Band Power Amplifier With Power Detector |
| Páginas / Página | 16 / 5 — Data Sheet. HMC7543. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. GND. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 247 Kb |
| Idioma del documento | Inglés |
Data Sheet. HMC7543. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. GND. DD1. VDD2. VDD3. VDD4. RFOUT. RFIN. TOP VIEW. (Not to Scale). VGG1. VGG2
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Data Sheet HMC7543 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 4 5 6 7 8 9 10 11 V GND DD1 GND VDD2 GND VDD3 GND VDD4 GND 12 3 GND HMC7543 2 RFOUT 13 RFIN TOP VIEW (Not to Scale) 1 GND GND 14 GND VGG1 GND VGG2 GND VGG3 GND VGG4 GND VREF VDET 25 24 23 22 21 20 19 18 17 16 15
002 13423- Figure 2. Pad Configuration
Table 4. Pad Function Descriptions Pad No. Mnemonic Description
1, 3, 4, 6, 8, 10, 12, GND Ground Connection (See Figure 3). 14, 17, 19, 21, 23, 25 2 RFIN RF Input. DC couple RFIN and match it to 50 Ω (See Figure 4). 5, 7, 9, 11 V to V Drain Bias Voltage for the Power Amplifier (See Figure 5). DD1 DD4 13 RFOUT RF Output. AC couple RFOUT and match it to 50 Ω (see Figure 6). 15 V Detector Voltage for the Power Detector (See Figure 7). V is the dc voltage representing the RF DET DET output power rectified by the diode, which is biased through an external resistor. Refer to the typical application circuit for the required external components (see Figure 40). 16 V Reference Voltage for the Power Detector (See Figure 7). V is the dc bias of the diode biased through REF REF an external resistor used for temperature compensation of V . Refer to the typical application circuit DET for the required external components (see Figure 40). 18, 20, 22, 24 V to V Gate Bias Voltage for the Power Amplifier (See Figure 8). For the required external components, see GG4 GG1 Figure 40. Die Bottom GND Ground. The die bottom must be connected to the RF/dc ground (see Figure 3). Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet HMC7543 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 4 5 6 7 8 9 10 11 V GND DD1 GND VDD2 GND VDD3 GND VDD4 GND 12 3 GND HMC7543 2 RFOUT 13 RFIN TOP VIEW (Not to Scale) 1 GND GND 14 GND VGG1 GND VGG2 GND VGG3 GND VGG4 GND VREF VDET 25 24 23 22 21 20 19 18 17 16 15
002 13423- Figure 2. Pad Configuration
Table 4. Pad Function Descriptions Pad No. Mnemonic Description
1, 3, 4, 6, 8, 10, 12, GND Ground Connection (See Figure 3). 14, 17, 19, 21, 23, 25 2 RFIN RF Input. DC couple RFIN and match it to 50 Ω (See Figure 4). 5, 7, 9, 11 V to V Drain Bias Voltage for the Power Amplifier (See Figure 5). DD1 DD4 13 RFOUT RF Output. AC couple RFOUT and match it to 50 Ω (see Figure 6). 15 V Detector Voltage for the Power Detector (See Figure 7). V is the dc voltage representing the RF DET DET output power rectified by the diode, which is biased through an external resistor. Refer to the typical application circuit for the required external components (see Figure 40). 16 V Reference Voltage for the Power Detector (See Figure 7). V is the dc bias of the diode biased through REF REF an external resistor used for temperature compensation of V . Refer to the typical application circuit DET for the required external components (see Figure 40). 18, 20, 22, 24 V to V Gate Bias Voltage for the Power Amplifier (See Figure 8). For the required external components, see GG4 GG1 Figure 40. Die Bottom GND Ground. The die bottom must be connected to the RF/dc ground (see Figure 3). Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE