Datasheet IMD111T-6F040, IMD112T-6F040 (Infineon) - 29

iMOTION™ IMD111T/IMD112T - Smart driver for motor control Motor controller with integrated high-voltage gate driver 4 Electrical characteristics and parameters 4.3.4 Timing diagrams
V 20 CCMAX , VBSMAX vCC V v 17.5 BS 10.0 VCCUV+, VBSUV+ 9.0 VCCUV-, VBSUV- 8.1 t IC STATE ON ON OFF ON Recommended ON Forbidden ON ON OFF Area Recommended Area Area
Figure 13 Operating Areas
Datasheet 29 1.0 2020-12-4 Document Outline Features Potential applications Product validation Description Table of contents 1 Block diagram reference 2 Pin configuration 2.1 Pin definitions and functions 2.2 Pin configuration drawing IMD111T 2.3 Pin configuration drawing IMD112T 3 Functional description 3.1 Overview 3.2 Motion Control Engine 3.3 Gate Driver 3.4 Low Side Supply (VCC, VSS and COM) 3.5 High Side Supplies (VB1,2,3 and VS1,2,3) 3.6 Low and High Side Outputs (LO1,2,3 and HO1,2,3) 3.7 Internal Voltage Regulator 3.8 Application diagrams 4 Electrical characteristics and parameters 4.1 General parameters 4.1.1 Parameter Interpretation 4.1.2 Absolute maximum ratings 4.1.3 Pin Reliability in Overload 4.1.4 Operating Conditions 4.2 DC characteristics 4.2.1 Input/Output Characteristics 4.2.2 Analog to Digital Converter (ADC) 4.2.3 Analog comparator characteristics 4.2.4 Power Supply Current 4.2.5 Flash Memory Parameters 4.2.6 Static parameters gate driver 4.2.7 Static parameters voltage regulator 4.3 AC characteristics 4.3.1 Testing Waveforms 4.3.2 On-Chip Oscillator Characteristics 4.3.3 Dynamic parameters gate driver 4.3.4 Timing diagrams 4.4 Motor Control Parameters 4.4.1 PWM Characteristics 4.4.2 Current Sensing 4.4.3 Fault Timing 4.5 Power Factor Correction (PFC) parameters 4.5.1 Boost PFC characteristics 4.5.2 Totem Pole PFC characteristics 4.5.3 PFC Current Sensing 4.6 Control Interface Parameters 4.6.1 Control Input Interfaces 4.6.2 Serial Interface Parameters 4.6.2.1 UART Interface 4.6.3 Over Temperature Input 4.6.4 Pulse Output 5 Device and package specifications 5.1 Quality declaration 5.2 SBSL and Chip-IDs 5.3 Thermal considerations 5.4 Package Outline PG-LQFP-40-1 5.5 Part marking information Revision history Disclaimer