Datasheet TLP241B, TLP241BF (Toshiba)

TLP241B,TLP241BF Photocouplers Photorelay TLP241B,TLP241BF 1. Applications • Mechanical relay replacements • Security Systems • Heating, ventilation and air conditioning (HVAC) • ATE (Automatic Test Equipment) • Factory Automation (FA) • Battery Management System (BMS) (Non-Automotive) 2. General The TLP241B and TLP241BF photorelay consist of a photo MOSFET optically coupled to an infrared light emitting diode. They are housed in a 4-pin DIP package. They provide an isolation voltage of 5000 Vrms, making them suitable for applications that require reinforced insulation. 3. Features (1) Halogen-free For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet. (2) Normally opened (1-Form-A) (3) OFF-state output terminal voltage: 100 V (min) (4) Trigger LED current: 3 mA (max) (5) ON-state current: 2.0 A (max) (6) ON-state resistance: 200 mΩ (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5 (Note 1) Note 1: When an EN 60747-5-5 approved type is needed, please designate the Option (D4). 4. Mechanical Parameters 7.62-mm Pitch 10.16-mm Pitch Characteristics Unit TLP241B TLP241BF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Start of commercial production 2020-12 ©2020 1 2020-12-02 Toshiba Electronic Devices & Storage Corporation Rev.1.0