Datasheet STM32WB5MMG (STMicroelectronics) - 7
| Fabricante | STMicroelectronics |
| Descripción | Bluetooth Low Energy 5.0 and 802.15.4 module |
| Páginas / Página | 31 / 7 — STM32WB5MMG. Pin description. Pin name. Pin name (function after reset). … |
| Formato / tamaño de archivo | PDF / 3.7 Mb |
| Idioma del documento | Inglés |
STM32WB5MMG. Pin description. Pin name. Pin name (function after reset). Pin type. STM32WB55VGY. DS13252. Rev 1. page 7/31
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STM32WB5MMG Pin description Pin name Pin name (function after reset) Pin type STM32WB5MMG STM32WB55VGY
47 K6 PB10 I/O 48 K7 PB2 I/O 49 G4 PC4 I/O 50 J7 PA8 I/O 51 K8 PA9 I/O 52 H6 PA7 I/O 53 H7 PA6 I/O 54 K9 PA5 I/O 55 K10 PA4 I/O 56 J8 PA3 I/O 57 - VSS S 58 - ANT_IN - 59 - RF_OUT - 60 - VSS S 61 E10 PH0 I/O 62 E9 PH1 I/O 63 D8 PD14 I/O 64 B10 PE1 I/O 65 C9 PD13 I/O 66 B8 PD12 I/O 67 A8 PD7 I/O 68 A7 PD2 I/O 69 B4 PC9 I/O 70 C2 PD3 I/O 71 E3 PC7 I/O 72 G2 PE3 I/O 73 D3 PD4 I/O 74 D5 PD9 I/O 75 D4 PD8 I/O 76 E7 PD15 I/O 77 E4 PD10 I/O 78 E6 PE2 I/O 79 C8 PE0 I/O 80 B7 PD5 I/O 81 C6 PD6 I/O 82 E5 PD11 I/O 83 F4 PC8 I/O 84 - VSS S 85 - ANT_NC - 86 - VSS S - D10 PC14-OSC32_IN I/O - D9 PC15-OSC32_OUT I/O - H10 VSSA S - J10 VDD S - K5 VDD S
DS13252
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Rev 1 page 7/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures
47 K6 PB10 I/O 48 K7 PB2 I/O 49 G4 PC4 I/O 50 J7 PA8 I/O 51 K8 PA9 I/O 52 H6 PA7 I/O 53 H7 PA6 I/O 54 K9 PA5 I/O 55 K10 PA4 I/O 56 J8 PA3 I/O 57 - VSS S 58 - ANT_IN - 59 - RF_OUT - 60 - VSS S 61 E10 PH0 I/O 62 E9 PH1 I/O 63 D8 PD14 I/O 64 B10 PE1 I/O 65 C9 PD13 I/O 66 B8 PD12 I/O 67 A8 PD7 I/O 68 A7 PD2 I/O 69 B4 PC9 I/O 70 C2 PD3 I/O 71 E3 PC7 I/O 72 G2 PE3 I/O 73 D3 PD4 I/O 74 D5 PD9 I/O 75 D4 PD8 I/O 76 E7 PD15 I/O 77 E4 PD10 I/O 78 E6 PE2 I/O 79 C8 PE0 I/O 80 B7 PD5 I/O 81 C6 PD6 I/O 82 E5 PD11 I/O 83 F4 PC8 I/O 84 - VSS S 85 - ANT_NC - 86 - VSS S - D10 PC14-OSC32_IN I/O - D9 PC15-OSC32_OUT I/O - H10 VSSA S - J10 VDD S - K5 VDD S
DS13252
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Rev 1 page 7/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures