Datasheet DPO2039DABQ-13 (Diodes) - 3
| Fabricante | Diodes |
| Descripción | 4-CH Over-Voltage Protection for CC/DIFF Pins on USB Type-C |
| Páginas / Página | 13 / 3 — DPO2039DABQ-13. Functional Block Diagram. T C U D O R P W E N. Figure 2. … |
| Formato / tamaño de archivo | PDF / 1.0 Mb |
| Idioma del documento | Inglés |
DPO2039DABQ-13. Functional Block Diagram. T C U D O R P W E N. Figure 2. Internal Functional Blocks. Absolute Maximum Ratings
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DPO2039DABQ-13 Functional Block Diagram T C U D O R P W E N Figure 2. Internal Functional Blocks Absolute Maximum Ratings
(@ TA = +25°C, unless otherwise specified) (Note 4)
Symbol Parameter Rating Unit
VVSYS Voltage Range of VSYS Pin -0.3 to 6.0 V VFAULTB Voltage Range of FAULTB Pin -0.3 to 6.0 V VCB Voltage Range of CB Pin -0.3 to 24 V VDIFFxS, VCCxS Voltage Range of DIFF1S, DIFF2S, CC1S, CC2S Pins -0.3 to 6.0 V VDIFFxC, VCCxC Voltage Range of DIFF1C, DIFF2C, CC1C, CC2C Pins -0.3 to 24.0 V TJ Operating Junction Temperature -40 to +150 °C TL Lead Temperature +260 °C TSTG Storage Temperature -65 to +150 °C Human Body Model (HBM), JESD22-A114 ±2.0 ESD kV Charge Device Model (CDM), JESD22-C101 ±0.5 Note: 4. These are stress ratings only. Operation outside the absolute maximum ratings can cause device failure. Operation at the absolute maximum rating for extended periods can reduce device reliability.
Package Thermal Data
(@ TA = +25°C, unless otherwise specified) (Note 5)
Symbol Parameter Rating Unit
PD Power Dissipation 1.75 W RθJA Thermal Resistance, Junction-to-Ambient 73 °C/W RθJC Thermal Resistance, Junction-to-Case 12.7 °C/W Note: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1” 1” copper pad layout. DPO2039DABQ-13 3 of 13 December 2019 Document number: DS41005 Rev. 1 - 2
www.diodes.com
© Diodes Incorporated
(@ TA = +25°C, unless otherwise specified) (Note 4)
Symbol Parameter Rating Unit
VVSYS Voltage Range of VSYS Pin -0.3 to 6.0 V VFAULTB Voltage Range of FAULTB Pin -0.3 to 6.0 V VCB Voltage Range of CB Pin -0.3 to 24 V VDIFFxS, VCCxS Voltage Range of DIFF1S, DIFF2S, CC1S, CC2S Pins -0.3 to 6.0 V VDIFFxC, VCCxC Voltage Range of DIFF1C, DIFF2C, CC1C, CC2C Pins -0.3 to 24.0 V TJ Operating Junction Temperature -40 to +150 °C TL Lead Temperature +260 °C TSTG Storage Temperature -65 to +150 °C Human Body Model (HBM), JESD22-A114 ±2.0 ESD kV Charge Device Model (CDM), JESD22-C101 ±0.5 Note: 4. These are stress ratings only. Operation outside the absolute maximum ratings can cause device failure. Operation at the absolute maximum rating for extended periods can reduce device reliability.
Package Thermal Data
(@ TA = +25°C, unless otherwise specified) (Note 5)
Symbol Parameter Rating Unit
PD Power Dissipation 1.75 W RθJA Thermal Resistance, Junction-to-Ambient 73 °C/W RθJC Thermal Resistance, Junction-to-Case 12.7 °C/W Note: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1” 1” copper pad layout. DPO2039DABQ-13 3 of 13 December 2019 Document number: DS41005 Rev. 1 - 2
www.diodes.com
© Diodes Incorporated