Datasheet MAX4475, MAX4476, MAX4477, MAX4478, MAX4488, MAX4489 (Maxim) - 4
| Fabricante | Maxim |
| Descripción | SOT23, Low-Noise, Low-Distortion, Wide-Band, Rail-to-Rail Op Amps |
| Páginas / Página | 17 / 4 — Package Information (continued). TDFN-6. PACKAGE CODE. T633+2. 21-0137. … |
| Formato / tamaño de archivo | PDF / 2.5 Mb |
| Idioma del documento | Inglés |
Package Information (continued). TDFN-6. PACKAGE CODE. T633+2. 21-0137. 90-0058. Thermal Resistance, Single-Layer Board
Línea de modelo para esta hoja de datos
- MAX4475ASA+ MAX4475ASA+T MAX4475ATT+ MAX4475ATT+T MAX4475AUA+ MAX4475AUA+T MAX4475AUT+ MAX4475AUT+T MAX4475AUT/V+ MAX4475AUT/V+T
- MAX4477ASA MAX4477ASA+ MAX4477ASA+T MAX4477AUA MAX4477AUA+ MAX4477AUA+T MAX4477AUA/V+ MAX4477AUA/V+T
Versión de texto del documento
MAX4475–MAX4478/ SOT23, Low-Noise, Low-Distortion, MAX4488/MAX4489 Wide-Band, Rail-to-Rail Op Amps
Package Information (continued) TDFN-6 PACKAGE CODE T633+2
Outline Number
21-0137
Land Pattern Number
90-0058 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 55°C/W Junction to Case (θJC) 9°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 42°C/W Junction to Case (θJC) 9°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 4
Package Information (continued) TDFN-6 PACKAGE CODE T633+2
Outline Number
21-0137
Land Pattern Number
90-0058 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 55°C/W Junction to Case (θJC) 9°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 42°C/W Junction to Case (θJC) 9°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 4