Datasheet MAX4475, MAX4476, MAX4477, MAX4478, MAX4488, MAX4489 (Maxim) - 3
| Fabricante | Maxim |
| Descripción | SOT23, Low-Noise, Low-Distortion, Wide-Band, Rail-to-Rail Op Amps |
| Páginas / Página | 17 / 3 — Package Information (continued). TSSOP-14. PACKAGE CODE. U14+2. 21-0066. … |
| Formato / tamaño de archivo | PDF / 2.5 Mb |
| Idioma del documento | Inglés |
Package Information (continued). TSSOP-14. PACKAGE CODE. U14+2. 21-0066. 90-0113. Thermal Resistance, Single-Layer Board
Línea de modelo para esta hoja de datos
- MAX4475ASA+ MAX4475ASA+T MAX4475ATT+ MAX4475ATT+T MAX4475AUA+ MAX4475AUA+T MAX4475AUT+ MAX4475AUT+T MAX4475AUT/V+ MAX4475AUT/V+T
- MAX4477ASA MAX4477ASA+ MAX4477ASA+T MAX4477AUA MAX4477AUA+ MAX4477AUA+T MAX4477AUA/V+ MAX4477AUA/V+T
Versión de texto del documento
MAX4475–MAX4478/ SOT23, Low-Noise, Low-Distortion, MAX4488/MAX4489 Wide-Band, Rail-to-Rail Op Amps
Package Information (continued) TSSOP-14 PACKAGE CODE U14+2
Outline Number
21-0066
Land Pattern Number
90-0113 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 110°C/W Junction to Case (θJC) 30°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 100.4°C/W Junction to Case (θJC) 30°C/W
SO-8 PACKAGE CODE S8+4
Outline Number
21-0041
Land Pattern Number
90-0096 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 170°C/W Junction to Case (θJC) 40
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 132°C/W Junction to Case (θJC) 38
SO-14 PACKAGE CODE S14+4
Outline Number
21-0041
Land Pattern Number
90-0112 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 120°C/W Junction to Case (θJC) 37°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 84°C/W Junction to Case (θJC) 34°C/W www.maximintegrated.com Maxim Integrated │ 3
Package Information (continued) TSSOP-14 PACKAGE CODE U14+2
Outline Number
21-0066
Land Pattern Number
90-0113 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 110°C/W Junction to Case (θJC) 30°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 100.4°C/W Junction to Case (θJC) 30°C/W
SO-8 PACKAGE CODE S8+4
Outline Number
21-0041
Land Pattern Number
90-0096 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 170°C/W Junction to Case (θJC) 40
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 132°C/W Junction to Case (θJC) 38
SO-14 PACKAGE CODE S14+4
Outline Number
21-0041
Land Pattern Number
90-0112 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 120°C/W Junction to Case (θJC) 37°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 84°C/W Junction to Case (θJC) 34°C/W www.maximintegrated.com Maxim Integrated │ 3