S i9 424Typical Characteristics (continued) DY 5 3500 f= 1 MHz (V) ID= -8.0A 3000 VGS= 0V GE 4 VDS= -5V A T L -10V pF) 2500 ( C -15V iss 3 E VO 2000 CANCER UCIT 1500 2 AAE-SO T 1000 CAP 1 , GA C GS 500 oss -V Crss 0 0 0 5 10 15 20 25 0 4 8 12 16 20 Qg, GATE CHARGE (nC)-VDS, DRAIN TO SOURCE VOLTAGE (V)Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics. 100 50 R 100µs DS(ON) LIMIT SINGLE PULSE o RθJA=125 C/W ) 10ms 40 o A 10 TA=25 C 100ms NT ( 1s 30 10s 1 DC 20 POWER (W) VGS= -4.5V , DRAIN CURRE D 0.1 -I SINGLE PULSE 10 o RθJA= 125 C/W o TA= 25 C 0 0.01 0.001 0.01 0.1 1 10 100 1000 0.1 1 10 100 SINGLE PULSE TIME (SEC)-VDS, DRAIN-SOURCE VOLTAGE (V)Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse MaximumPower Dissipation. 1 CE 0.5 D = 0.5 EAN T R (t) = r(t) * R IV 0.2 0.2 θJA θJA ISCTS R = 125°C/W θJA EE 0.1 0.1 FR LEF 0.05 A 0.05 DM P(pk) ER 0.02 IZE 0.02 HAL 0.01 t T 1 0.01 t 2 RM Single Pulse NTOIE 0.005 T - T = P * R (t) J A θJA r(t), N Duty Cycle, D = t /t 1 2 RANS 0.002 T 0.001 0.0001 0.001 0.01 0.1 1 10 100 300 t , TIME (sec) 1 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1c. Transient themal response will change depending on the circuit board design. Si9424DY Rev.A