Datasheet ADP1878, ADP1879 (Analog Devices) - 5

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Data Sheet ADP1878/ADP1879 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2.
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. VREG to PGND, GND −0.3 V to +6 V VIN, EN, PGOOD to PGND −0.3 V to +28 V
Boundary Condition
FB, COMP, RES, SS to GND −0.3 V to (VREG + 0.3 V) In determining the values given in Table 2 and Table 3, natural DRVL to PGND −0.3 V to (VREG + 0.3 V) convection is used to transfer heat to a 4-layer evaluation board. SW to PGND −2.0 V to +28 V BST to SW −0.6 V to (VREG + 0.3 V)
Table 3. Thermal Resistance
BST to PGND −0.3 V to +28 V
Package Type θJA Unit
DRVH to SW −0.3 V to VREG θJA (14-Lead LFCSP_WD) PGND to GND ±0.3 V 4-Layer Board 30 °C/W PGOOD Input Current 35 mA θJA (14-Lead LFCSP_WD) 4-Layer Board 30°C/W
ESD CAUTION
Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Maximum Soldering Lead Temperature 300°C (10 sec) Stresses a bove those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to PGND. Rev. B | Page 5 of 40 Document Outline Features Applications Typical Applications Circuit General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance Boundary Condition ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Block Diagram Startup Soft Start Precision Enable Circuitry Undervoltage Lockout On-Board Low Dropout (LDO) Regulator Thermal Shutdown Programming Resistor (RES) Detect Circuit Valley Current-Limit Setting Hiccup Mode During Short Circuit Synchronous Rectifier ADP1879 Power Saving Mode (PSM) Timer Operation Pseudo Fixed Frequency Power-Good Monitoring Applications Information Feedback Resistor Divider Inductor Selection Output Ripple Voltage (ΔVRR) Output Capacitor Selection Compensation Network Output Filter Impedance (ZFILT) Error Amplifier Output Impedance (ZCOMP) Error Amplifier Gain (Gm) Current-Sense Loop Gain (GCS) Crossover Frequency Efficiency Consideration Channel Conduction Loss MOSFET Driver Loss MOSFET Switching Loss Body Diode Conduction Loss Inductor Loss Input Capacitor Selection Thermal Considerations Design Example Input Capacitor Inductor Current-Limit Programming Output Capacitor Feedback Resistor Network Setup Compensation Network Loss Calculations External Component Recommendations Layout Considerations IC Section (Left Side of Evaluation Board) Power Section Differential Sensing Typical Application Circuits 12 A, 300 kHz High Current Application Circuit 5.5 V Input, 600 kHz Current Application Circuit 300 kHz High Current Application Circuit Packaging and Ordering Information Outline Dimensions Ordering Guide