Datasheet ADA4897-2-KGD (Analog Devices) - 10

ADA4897-2-KGD Known Good Die OUTLINE DIMENSIONS 0.483 1.095 10 10A 1A 1 9 9A 1.445 2 3 8 4 7 4A 5 6 A 0.070 × 0.140 TOP VIEW SIDE VIEW 2015- (CIRCUIT SIDE) 0.070 × 0.070 09- 03-
Figure 2. 10-Pad Bare Die [CHIP] (C-10-6) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 1095 × 1445 μm Thickness 483 μm Bond Pads (Minimum Size) 70 × 70 μm Bond Pad Composition 1% AlCu % Backside Si Not applicable Passivation Doped oxide/SiN Not applicable ESD HBM 2000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADA4897-2-KGD −40°C to +125°C 10-Pad Bare Die [CHIP] C-10-6
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Rev. C | Page 10 of 10 Document Outline Features Applications General Description Revision History Specifications ±5 V Supply +5 V Supply +3 V Supply Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide