Datasheet MLX75027 (Melexis) - 3

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MLX75027 VGA Time-of-Flight Sensor
PRELIMINARY DATASHEET 7.4. HMAX & Frame Read-Out Time ... 33 7.5. PARAM_HOLD .. 35 7.6. USER_ID Register ... 35 7.7. Modulation Frequency .. 36 7.8. Frame Structure & Frame Rate .. 37 7.9. FRAME_STARTUP ... 38 7.10. FRAME_TIME ... 38 7.11. PHASE_COUNT ... 38 7.12. Px_PREHEAT, Px_PREMIX .. 39 7.13. Px_INTEGRATION ... 41 7.14. Px_PHASE_SHIFT .. 42 7.15. Px_PHASE_IDLE (or V-blanking) ... 43 7.16. Px_LEDEN ... 43 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED .. 44 7.18. Analog Delay Setting .. 45 7.19. Pixel Binning ... 47 7.20. Region of Interest (ROI) ... 48 7.21. Flip & Mirror .. 49 7.22. Temperature Sensor .. 49 7.23. Pixel & Phase Statistics .. 50 7.24. PN9 Test Pattern .. 53 7.25. Duty Cycle Adjustment .. 54 7.26. Illumination Signal (subLVDS or CMOS) ... 55 8. MetaData Description ... 55 8.1. Embedded Data Format in 4 Lane MIPI Configuration .. 57 8.2. Embedded Data Format in 2 Lane MIPI Configuration .. 57 9. Distance & Amplitude Calculation ... 58 10. Package Information ... 59 10.1. Transmittance and Reflectance ... 59 10.2. Pinout & Equivalent I/O Circuitry .. 60 10.3. Mechanical Dimensions ... 64 10.4. Package Marking .. 64 10.5. PCB Landing Pattern .. 64 10.6. Reflow Solder Profile ... 65 10.7. Reflow Cleaning Instructions ... 65 Preliminary Datasheet v0.9 Page 3 of 67 Document Outline Table of Contents Document Revision History Ordering Information 1. System Architecture 2. Sensor Block Diagram 3. Electrical Specifications 3.1. Absolute Maximum Ratings 3.2. Typical Operating Conditions 3.3. Video Interface 3.3.1. MIPI DC specification 3.3.2. MIPI AC specification 3.4. Power Consumption 3.5. Maximum Distance Frame Rate 3.6. Decoupling Recommendations 3.7. Power-up Sequence 3.8. Input Clock Requirements 3.9. I2C Specifications 4. Optical Characteristics 4.1. VGA Pixel Array Configuration 4.2. Pixel & Image Array Characteristics 4.3. CRA (Chief Ray Angle) 4.4. MTF (Modulation Transfer Function ) 4.5. Application Lens Design Recommendations 5. Communication Interface(s) 5.1. I2C (Inter-Integrated Circuit) 5.1.1. I2C Timing Sequence 5.1.2. Single I2C Read 5.1.3. Sequential I2C Read 5.1.4. Single I2C Write 5.1.5. Sequential I2C Write 5.1.6. I2C Slave Address 5.2. MIPI Alliance CSI-2 Description 5.2.1. Packet Structure 5.2.2. Data Format RAW12 5.2.2.1. Data Format in 4 Lane MIPI Configuration 5.2.2.2. Data Format in 2 Lane MIPI Configuration 6. Start-up Sequence 6.1. Initialization Process 6.2. Initialization Register Map 7. Register Settings 7.1. Video Output Configuration 7.2. Modes of Operation 7.3. Data Output Modes 7.4. HMAX & Frame Read-Out Time 7.4.1. PLLSSETUP 7.4.2. PRETIME 7.4.3. RANDNM0 7.5. PARAM_HOLD 7.6. USER_ID Register 7.7. Modulation Frequency 7.8. Frame Structure & Frame Rate 7.9. FRAME_STARTUP 7.10. FRAME_TIME 7.11. PHASE_COUNT 7.12. Px_PREHEAT, Px_PREMIX 7.13. Px_INTEGRATION 7.14. Px_PHASE_SHIFT 7.15. Px_PHASE_IDLE (or V-blanking) 7.16. Px_LEDEN 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED 7.18. Analog Delay Setting 7.18.1. Coarse Delay 7.18.2. Fine Delay 7.18.3. Super Fine 7.19. Pixel Binning 7.20. Region of Interest (ROI) 7.21. Flip & Mirror 7.22. Temperature Sensor 7.23. Pixel & Phase Statistics 7.24. PN9 Test Pattern 7.25. Duty Cycle Adjustment 7.26. Illumination Signal (subLVDS or CMOS) 8. MetaData Description 8.1. Embedded Data Format in 4 Lane MIPI Configuration 8.2. Embedded Data Format in 2 Lane MIPI Configuration 9. Distance & Amplitude Calculation 10. Package Information 10.1. Transmittance and Reflectance 10.2. Pinout & Equivalent I/O Circuitry 10.3. Mechanical Dimensions 10.4. Package Marking 10.5. PCB Landing Pattern 10.6. Reflow Solder Profile 10.7. Reflow Cleaning Instructions 10.8. Cover Tape Removal Disclaimer