Datasheet EPC2215 (Efficient Power Conversion) - 5

eGaN® FET DATASHEET
EPC2215
TAPE AND REEL CONFIGURATION e f
4 mm pitch, 12 mm wide tape on 7” reel
g
Loaded Tape Feed Direction
d
7” inch reel Die
b
orientation dot
Z Z ZZ c Y YYY
Gate solder bar
a
is under this
2215
corner Die is placed into pocket
h
solder bump side down
DIM Dimension (mm)
(face side down)
EPC2215 (Note 1) Target MIN MAX a
12.00 11.90 12.30
b
1.75 1.65 1.85
c
(Note 2) 5.50 5.45 5.55
d
4.00 3.90 4.10
e
4.00 3.90 4.10 Note 1: MSL 1 (moisture sensitivity level 1) classified according to IPC/
f
(Note 2) 2.00 1.95 2.05 JEDEC industry standard.
g
1.50 1.50 1.60 Note 2: Pocket position is relative to the sprocket hole measured as
h
1.50 0.95 1.05 true position of the pocket, not the pocket hole.
DIE MARKINGS 2215 YYYY Laser Markings
Die orientation dot
Part ZZZZ Number Part # Lot_Date Code Lot_Date Code Marking Line 1 Marking Line 2 Marking Line 3
Gate Pad bump is EPC2215 2215 YYYY ZZZZ under this corner
DIE OUTLINE
Solder Bump View
Micrometers
A
DIM MIN Nominal MAX A
4570 4600 4630
2
h
B
1570 1600 1630
c
1210 d j
3 4 5
c
6
B
d
1450
e
1000
1
g
f
275
g
450 f e
h
700
j
875 Side View ± -25 518 638
Pad 1 is Gate; Pads 2 ,4, 6 are Source; Pads 3, 5 are Drain;
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