Datasheet AD8222 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | Precision, Dual-Channel Instrumentation Amplifier |
| Páginas / Página | 24 / 6 — AD8222. Data Sheet. ABSOLUTE MAXIMUM RATINGS. Table 5. THERMAL … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 530 Kb |
| Idioma del documento | Inglés |
AD8222. Data Sheet. ABSOLUTE MAXIMUM RATINGS. Table 5. THERMAL RESISTANCE. Parameter Rating. Table 6. Package θJA Unit
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AD8222 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating Table 6.
Supply Voltage ±18 V
Package θJA Unit
Output Short-Circuit Current Duration Indefinite CP-16-19: LFCSP Without Thermal Pad 86 °C/W Input Voltage (Common Mode) ±VS CP-16-26: LFCSP with Thermal Pad 48 °C/W Differential Input Voltage ±VS The θ Storage Temperature Range −65°C to +130°C JA values in Table 6 assume a 4-layer JEDEC standard board. For the LFCSP with thermal pad, it is assumed that the Operational Temperature Range −40°C to +125°C thermal pad is soldered to a landing on the PCB board, with the Package Glass Transition Temperature (TG) 130°C landing thermally connected to a heat dissipating power plane. ESD θ Human Body Model 2 kV JC at the exposed pad is 4.4°C/W. Charge Device Model 1 kV
Maximum Power Dissipation
Stresses at or above those listed under Absolute Maximum The maximum safe power dissipation for the AD8222 is limited Ratings may cause permanent damage to the product. This is a by the associated rise in junction temperature (TJ) on the die. At stress rating only; functional operation of the product at these approximately 130C, which is the glass transition temperature, or any other conditions above those indicated in the operational the plastic changes its properties. Even temporarily exceeding section of this specification is not implied. Operation beyond this temperature limit may change the stresses that the package the maximum operating conditions for extended periods may exerts on the die, permanently shifting the parametric performance affect product reliability. of the amplifiers. Exceeding a temperature of 130°C for an extended period can result in a loss of functionality.
ESD CAUTION
Rev. B | Page 6 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION AMPLIFIER ARCHITECTURE GAIN SELECTION REFERENCE TERMINAL PACKAGE CONSIDERATIONS Package Without Thermal Pad Package with Thermal Pad LAYOUT Common-Mode Rejection Over Frequency Reference Power Supplies INPUT BIAS CURRENT RETURN PATH INPUT PROTECTION Input Voltages Beyond the Rails Differential Input Voltages at High Gains RF INTERFERENCE COMMON-MODE INPUT VOLTAGE RANGE APPLICATIONS INFORMATION DIFFERENTIAL OUTPUT Setting the Common-Mode Voltage 2-Channel Differential Output Using a Dual Op Amp DRIVING A DIFFERENTIAL INPUT ADC RFI and Antialiasing Filter Second Antialiasing Filter Reference PRECISION STRAIN GAGE DRIVING CABLING OUTLINE DIMENSIONS ORDERING GUIDE
AD8222 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating Table 6.
Supply Voltage ±18 V
Package θJA Unit
Output Short-Circuit Current Duration Indefinite CP-16-19: LFCSP Without Thermal Pad 86 °C/W Input Voltage (Common Mode) ±VS CP-16-26: LFCSP with Thermal Pad 48 °C/W Differential Input Voltage ±VS The θ Storage Temperature Range −65°C to +130°C JA values in Table 6 assume a 4-layer JEDEC standard board. For the LFCSP with thermal pad, it is assumed that the Operational Temperature Range −40°C to +125°C thermal pad is soldered to a landing on the PCB board, with the Package Glass Transition Temperature (TG) 130°C landing thermally connected to a heat dissipating power plane. ESD θ Human Body Model 2 kV JC at the exposed pad is 4.4°C/W. Charge Device Model 1 kV
Maximum Power Dissipation
Stresses at or above those listed under Absolute Maximum The maximum safe power dissipation for the AD8222 is limited Ratings may cause permanent damage to the product. This is a by the associated rise in junction temperature (TJ) on the die. At stress rating only; functional operation of the product at these approximately 130C, which is the glass transition temperature, or any other conditions above those indicated in the operational the plastic changes its properties. Even temporarily exceeding section of this specification is not implied. Operation beyond this temperature limit may change the stresses that the package the maximum operating conditions for extended periods may exerts on the die, permanently shifting the parametric performance affect product reliability. of the amplifiers. Exceeding a temperature of 130°C for an extended period can result in a loss of functionality.
ESD CAUTION
Rev. B | Page 6 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION AMPLIFIER ARCHITECTURE GAIN SELECTION REFERENCE TERMINAL PACKAGE CONSIDERATIONS Package Without Thermal Pad Package with Thermal Pad LAYOUT Common-Mode Rejection Over Frequency Reference Power Supplies INPUT BIAS CURRENT RETURN PATH INPUT PROTECTION Input Voltages Beyond the Rails Differential Input Voltages at High Gains RF INTERFERENCE COMMON-MODE INPUT VOLTAGE RANGE APPLICATIONS INFORMATION DIFFERENTIAL OUTPUT Setting the Common-Mode Voltage 2-Channel Differential Output Using a Dual Op Amp DRIVING A DIFFERENTIAL INPUT ADC RFI and Antialiasing Filter Second Antialiasing Filter Reference PRECISION STRAIN GAGE DRIVING CABLING OUTLINE DIMENSIONS ORDERING GUIDE