Datasheet DA9132-A (Dialog Semiconductor) - 2
Fabricante | Dialog Semiconductor |
Descripción | High-Performance, Dual-Channel DC-DC Converter |
Páginas / Página | 53 / 2 — DA9132-A. High-Performance, Dual-Channel DC-DC Converter. Applications. … |
Formato / tamaño de archivo | PDF / 1.2 Mb |
Idioma del documento | Inglés |
DA9132-A. High-Performance, Dual-Channel DC-DC Converter. Applications. Datasheet. Revision 1.0. 31-Aug-2020
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DA9132-A High-Performance, Dual-Channel DC-DC Converter
■ Key safety features □ Output under-voltage and over-voltage protection □ Input under-voltage protection □ 2-step over-temperature protection
Applications
■ Vehicle infotainment systems ■ Telematics ■ ADAS ■ SoC/FPGA based, high performance, ■ Automotive navigation automotive Electronic Control unit (ECUI) requiring efficient, high current, power ■ Automotive center console delivery
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 2 of 53 © 2020 Dialog Semiconductor Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection