EFM8LB1 Data Sheet Feature List 1. Feature List The EFM8LB1 device family are fully integrated, mixed-signal system-on-a-chip MCUs. Highlighted features are listed below. • Core: • Analog: • Pipelined CIP-51 Core • 14/12/10-Bit Analog-to-Digital Converter (ADC) • Fully compatible with standard 8051 instruction set • Internal calibrated temperature sensor (±3 °C) • 70% of instructions execute in 1-2 clock cycles • 4 x 12-Bit Digital-to-Analog Converters (DAC) • 72 MHz maximum operating frequency • 2 x Low-current analog comparators with adjustable refer- • Memory: ence • Up to 64 kB flash memory (63 kB user-accessible), in-sys- • Communications and Digital Peripherals: tem re-programmable from firmware in 512-byte sectors • 2 x UART, up to 3 Mbaud • Up to 4352 bytes RAM (including 256 bytes standard 8051 • SPI™ Master / Slave, up to 12 Mbps RAM and 4096 bytes on-chip XRAM) • SMBus™/I2C™ Master / Slave, up to 400 kbps • Power: • I2C High-Speed Slave, up to 3.4 Mbps • Internal LDO regulator for CPU core voltage • 16-bit CRC unit, supporting automatic CRC of flash at 256- • Power-on reset circuit and brownout detectors byte boundaries • I/O: Up to 29 total multifunction I/O pins: • 4 Configurable Logic Units • Up to 25 pins 5 V tolerant under bias • Timers/Counters and PWM: • Selectable state retention through reset events • 6-channel Programmable Counter Array (PCA) supporting • Flexible peripheral crossbar for peripheral routing PWM, capture/compare, and frequency output modes • 5 mA source, 12.5 mA sink allows direct drive of LEDs • 6 x 16-bit general-purpose timers • Clock Sources: • Independent watchdog timer, clocked from the low frequen- • Internal 72 MHz oscillator with accuracy of ±2% cy oscillator • Internal 24.5 MHz oscillator with ±2% accuracy • On-Chip, Non-Intrusive Debugging • Internal 80 kHz low-frequency oscillator • Full memory and register inspection • External CMOS clock option (up to 50 MHz) • Four hardware breakpoints, single-stepping • External RC oscillator (up to 3.2 MHz) • Pre-programmed UART or SMBus bootloader With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the EFM8LB1 devices are truly standalone system-on-a-chip solutions. The flash memory is reprogrammable in-circuit, providing nonvolatile data storage and allowing field up- grades of the firmware. The on-chip debugging interface (C2) allows non-intrusive (uses no on-chip resources), full speed, in-circuit debugging using the production MCU installed in the final application. This debug logic supports inspection and modification of memory and registers, setting breakpoints, single stepping, and run and halt commands. All analog and digital peripherals are fully functional while debugging. Device operation is specified from 2.2 V up to a 3.6 V supply. Devices are available in 4x4 mm 32-pin QFN, 3x3 mm 24-pin QFN, 32-pin QFP, or 24-pin QSOP packages. All package options are lead-free and RoHS compliant. silabs.com | Building a more connected world. Rev. 1.3 | 2 Document Outline 1. Feature List 2. Ordering Information 3. System Overview 3.1 Introduction 3.2 Power 3.3 I/O 3.4 Clocking 3.5 Counters/Timers and PWM 3.6 Communications and Other Digital Peripherals 3.7 Analog 3.8 Reset Sources 3.9 Debugging 3.10 Bootloader 4. Electrical Specifications 4.1 Electrical Characteristics 4.1.1 Recommended Operating Conditions 4.1.2 Power Consumption 4.1.3 Reset and Supply Monitor 4.1.4 Flash Memory 4.1.5 Power Management Timing 4.1.6 Internal Oscillators 4.1.7 External Clock Input 4.1.8 External Oscillator 4.1.9 ADC 4.1.10 Voltage Reference 4.1.11 Temperature Sensor 4.1.12 1.8 V Internal LDO Voltage Regulator 4.1.13 DACs 4.1.14 Comparators 4.1.15 Configurable Logic 4.1.16 Port I/O 4.1.17 SMBus 4.2 Thermal Conditions 4.3 Absolute Maximum Ratings 5. Typical Connection Diagrams 5.1 Power 5.2 Debug 5.3 Other Connections 6. Pin Definitions 6.1 EFM8LB1x-QFN32 Pin Definitions 6.2 EFM8LB1x-QFP32 Pin Definitions 6.3 EFM8LB1x-QFN24 Pin Definitions 6.4 EFM8LB1x-QSOP24 Pin Definitions 7. QFN32 Package Specifications 7.1 Package Dimensions 7.2 PCB Land Pattern 7.3 Package Marking 8. QFP32 Package Specifications 8.1 Package Dimensions 8.2 PCB Land Pattern 8.3 Package Marking 9. QFN24 Package Specifications 9.1 Package Dimensions 9.2 PCB Land Pattern 9.3 Package Marking 10. QSOP24 Package Specifications 10.1 Package Dimensions 10.2 PCB Land Pattern 10.3 Package Marking 11. Revision History