Datasheet ADP1706, ADP1707, ADP1708 (Analog Devices) - 7
| Fabricante | Analog Devices |
| Descripción | 1 A, Low Dropout, CMOS Linear Regulator |
| Páginas / Página | 20 / 7 — Data Sheet. ADP1706/ADP1707/ADP1708. EN 1. 8 TRK. GND. ADP1707. 7 SENSE. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 531 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADP1706/ADP1707/ADP1708. EN 1. 8 TRK. GND. ADP1707. 7 SENSE. GND 2. IN 3. TOP VIEW. 6 OUT. (Not to Scale). IN 4. 5 OUT. NOTES
Línea de modelo para esta hoja de datos
- ADP1706ACPZ-1.05R7 ADP1706ACPZ-1.2-R7 ADP1706ACPZ-1.3-R7 ADP1706ACPZ-1.5-R7 ADP1706ACPZ-2.5-R7 ADP1706ACPZ-3.3-R7 ADP1706ARDZ-1.15R7 ADP1706ARDZ-1.2-R7 ADP1706ARDZ-1.3-R7 ADP1706ARDZ-1.5-R7 ADP1706ARDZ-1.8-R7 ADP1706ARDZ-2.5-R7 ADP1706ARDZ-3.0-R7 ADP1706ARDZ-3.3-R7
Versión de texto del documento
link to page 12
Data Sheet ADP1706/ADP1707/ADP1708 EN 1 8 TRK EN 1 8 TRK GND ADP1707 2 7 SENSE GND 2 7 SENSE ADP1707 IN 3 TOP VIEW 6 OUT TOP VIEW (Not to Scale) IN 3 6 OUT (Not to Scale) IN 4 5 OUT IN 4 5 OUT NOTES NOTES 1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE 1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
6
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
-00
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
0 -009
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
64
ON THE BOARD.
40 06
ON THE BOARD.
066 Figure 6. 8-Lead SOIC, ADP1707 Figure 7. 8-Lead LFCSP, ADP1707
Table 5. ADP1707 Pi n Function Descriptions Pin No. SOIC LFCSP Mnemonic Description
1 1 EN Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to IN. 2 2 GND Ground. 3, 4 3, 4 IN Regulator Input Supply. Bypass IN to GND with a 4.7 μF or greater capacitor. 5, 6 5, 6 OUT Regulated Output Voltage. Bypass OUT to GND with a 4.7 μF or greater capacitor. 7 7 SENSE Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop between the regulator output and the load. 8 8 TRK Track. The output follows the voltage applied at the TRK pin. See the Theory of Operation section for a more detailed description. 0 0 EP Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. It is recommended to connect the exposed pad to the ground plane on the board. Rev. A | Page 7 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT START FUNCTION (ADP1706) ADJUSTABLE OUTPUT VOLTAGE (ADP1708) TRACK MODE (ADP1707) ENABLE FEATURE APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties VOLTAGE TRACKING APPLICATIONS CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE NOTES
Data Sheet ADP1706/ADP1707/ADP1708 EN 1 8 TRK EN 1 8 TRK GND ADP1707 2 7 SENSE GND 2 7 SENSE ADP1707 IN 3 TOP VIEW 6 OUT TOP VIEW (Not to Scale) IN 3 6 OUT (Not to Scale) IN 4 5 OUT IN 4 5 OUT NOTES NOTES 1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE 1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
6
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
-00
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
0 -009
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
64
ON THE BOARD.
40 06
ON THE BOARD.
066 Figure 6. 8-Lead SOIC, ADP1707 Figure 7. 8-Lead LFCSP, ADP1707
Table 5. ADP1707 Pi n Function Descriptions Pin No. SOIC LFCSP Mnemonic Description
1 1 EN Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to IN. 2 2 GND Ground. 3, 4 3, 4 IN Regulator Input Supply. Bypass IN to GND with a 4.7 μF or greater capacitor. 5, 6 5, 6 OUT Regulated Output Voltage. Bypass OUT to GND with a 4.7 μF or greater capacitor. 7 7 SENSE Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop between the regulator output and the load. 8 8 TRK Track. The output follows the voltage applied at the TRK pin. See the Theory of Operation section for a more detailed description. 0 0 EP Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. It is recommended to connect the exposed pad to the ground plane on the board. Rev. A | Page 7 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT START FUNCTION (ADP1706) ADJUSTABLE OUTPUT VOLTAGE (ADP1708) TRACK MODE (ADP1707) ENABLE FEATURE APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties VOLTAGE TRACKING APPLICATIONS CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE NOTES