Datasheet ADP1706, ADP1707, ADP1708 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 1 A, Low Dropout, CMOS Linear Regulator |
| Páginas / Página | 20 / 5 — Data Sheet. ADP1706/ADP1707/ADP1708. ABSOLUTE MAXIMUM RATINGS Table 2. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 531 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADP1706/ADP1707/ADP1708. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating
Línea de modelo para esta hoja de datos
- ADP1706ACPZ-1.05R7 ADP1706ACPZ-1.2-R7 ADP1706ACPZ-1.3-R7 ADP1706ACPZ-1.5-R7 ADP1706ACPZ-2.5-R7 ADP1706ACPZ-3.3-R7 ADP1706ARDZ-1.15R7 ADP1706ARDZ-1.2-R7 ADP1706ARDZ-1.3-R7 ADP1706ARDZ-1.5-R7 ADP1706ARDZ-1.8-R7 ADP1706ARDZ-2.5-R7 ADP1706ARDZ-3.0-R7 ADP1706ARDZ-3.3-R7
Versión de texto del documento
Data Sheet ADP1706/ADP1707/ADP1708 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device IN to GND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN EN to GND –0.3 V to +6 V
Table 3. Thermal Resistance
SS/ADJ/TRK to GND –0.3 V to +6 V
Package Type θJA Unit
SENSE to GND –0.3 V to +6 V 8-Lead SOIC (Exposed Paddle) 58 °C/W Storage Temperature Range –65°C to +150°C 8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle) 66 °C/W Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT START FUNCTION (ADP1706) ADJUSTABLE OUTPUT VOLTAGE (ADP1708) TRACK MODE (ADP1707) ENABLE FEATURE APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties VOLTAGE TRACKING APPLICATIONS CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE NOTES
θJA is specified for the worst-case conditions, that is, a device IN to GND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN EN to GND –0.3 V to +6 V
Table 3. Thermal Resistance
SS/ADJ/TRK to GND –0.3 V to +6 V
Package Type θJA Unit
SENSE to GND –0.3 V to +6 V 8-Lead SOIC (Exposed Paddle) 58 °C/W Storage Temperature Range –65°C to +150°C 8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle) 66 °C/W Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT START FUNCTION (ADP1706) ADJUSTABLE OUTPUT VOLTAGE (ADP1708) TRACK MODE (ADP1707) ENABLE FEATURE APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties VOLTAGE TRACKING APPLICATIONS CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE NOTES