Datasheet ADM7172-KGD (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 6.5 V, 2 A, Ultralow Noise, High PSRR, Fast Transient Response CMOS LDO |
| Páginas / Página | 7 / 6 — ADM7172-KGD. Known Good Die. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 157 Kb |
| Idioma del documento | Inglés |
ADM7172-KGD. Known Good Die. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. Table 4. Pad Function Descriptions Pad. X-Axis (µm)
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ADM7172-KGD Known Good Die PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1A 8C 1B 8B 1C 8A 2A 7C 2B 7B 2C 7A 6B 3 6A
001
4 5
132806- Figure 1. Pad Configuration
Table 4. Pad Function Descriptions Pad X-Axis (µm) Y-Axis (µm) Mnemonic Pad Type Description
1A −392.275 +799.55 VOUT1A Triple Regulated Output Voltage, Triple Bond Pad. 1B −392.275 +607.9 VOUT1B Triple Regulated Output Voltage, Triple Bond Pad. 1C −392.275 +483.05 VOUT1C Triple Regulated Output Voltage, Triple Bond Pad. 2A −392.275 +306.2 VOUT2A Triple Regulated Output Voltage, Triple Bond Pad. 2B −392.275 +120.8 VOUT2B Triple Regulated Output Voltage, Triple Bond Pad. 2C −392.275 −8.35 VOUT2C Triple Regulated Output Voltage, Triple Bond Pad. 3 −392.25 −424.55 SENSE Single Sense Input. 4 −392.25 −660.925 SS Single Soft Start. 5 +400 −501.6 EN Single Regulator Enable. 6A +399.8 −366.225 GNDA Double Ground, Double Bond Pad. 6B +399.8 −271.225 GNDB Double Ground, Double Bond Pad. 7A +246.6 −70.8 VIN1A Triple Regulator Input Supply, Triple Bond Pad. 7B +246.6 +33.7 VIN1B Triple Regulator Input Supply, Triple Bond Pad. 7C +246.6 +268.9 VIN1C Triple Regulator Input Supply, Triple Bond Pad. 8A +246.6 +462.75 VIN2A Triple Regulator Input Supply, Triple Bond Pad. 8B +246.6 +588.7 VIN2B Triple Regulator Input Supply, Triple Bond Pad. 8C +246.6 +818.1 VIN2C Triple Regulator Input Supply, Triple Bond Pad. Rev. A | Page 6 of 7 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
001
4 5
132806- Figure 1. Pad Configuration
Table 4. Pad Function Descriptions Pad X-Axis (µm) Y-Axis (µm) Mnemonic Pad Type Description
1A −392.275 +799.55 VOUT1A Triple Regulated Output Voltage, Triple Bond Pad. 1B −392.275 +607.9 VOUT1B Triple Regulated Output Voltage, Triple Bond Pad. 1C −392.275 +483.05 VOUT1C Triple Regulated Output Voltage, Triple Bond Pad. 2A −392.275 +306.2 VOUT2A Triple Regulated Output Voltage, Triple Bond Pad. 2B −392.275 +120.8 VOUT2B Triple Regulated Output Voltage, Triple Bond Pad. 2C −392.275 −8.35 VOUT2C Triple Regulated Output Voltage, Triple Bond Pad. 3 −392.25 −424.55 SENSE Single Sense Input. 4 −392.25 −660.925 SS Single Soft Start. 5 +400 −501.6 EN Single Regulator Enable. 6A +399.8 −366.225 GNDA Double Ground, Double Bond Pad. 6B +399.8 −271.225 GNDB Double Ground, Double Bond Pad. 7A +246.6 −70.8 VIN1A Triple Regulator Input Supply, Triple Bond Pad. 7B +246.6 +33.7 VIN1B Triple Regulator Input Supply, Triple Bond Pad. 7C +246.6 +268.9 VIN1C Triple Regulator Input Supply, Triple Bond Pad. 8A +246.6 +462.75 VIN2A Triple Regulator Input Supply, Triple Bond Pad. 8B +246.6 +588.7 VIN2B Triple Regulator Input Supply, Triple Bond Pad. 8C +246.6 +818.1 VIN2C Triple Regulator Input Supply, Triple Bond Pad. Rev. A | Page 6 of 7 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE