Datasheet ADCMP341, ADCMP343 (Analog Devices) - 4

ADCMP341/ADCMP343 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Table 2.
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. VDD −0.3 V to +6 V ±INA_U, ±INA_L, ±INB_U, ±INB_L −0.3 V to +6 V
Table 3. Thermal Resistance
OUTA, OUTB −0.3 V to +6 V
Package Type θJA Unit
Operating Temperature Range −40°C to +125°C 8-Lead SOT-23 211.5 °C/W Storage Temperature Range −65°C to +150°C Lead Temperature Soldering (10 sec) 300°C
ESD CAUTION
Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 4 of 12 Document Outline Features Applications General Description Functional Block Diagrams Revision History Specifications Absolute Maximum Ratings Thermal Characteristics ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Application Information Comparators and Internal Reference Power Supply Inputs Outputs Programming Hysteresis Layout Recommendations Outline Dimensions Ordering Guide