Datasheet ICS-40638 (TDK) - 5
| Fabricante | TDK |
| Descripción | High AOP Analog MEMS Microphone with Differential Output |
| Páginas / Página | 14 / 5 — ICS‐40638. SOLDERING PROFILE . CRITICAL ZONE. TL TO TP. RAMP-UP. E T. … |
| Formato / tamaño de archivo | PDF / 391 Kb |
| Idioma del documento | Inglés |
ICS‐40638. SOLDERING PROFILE . CRITICAL ZONE. TL TO TP. RAMP-UP. E T. SMAX. TU A R E. SMIN. M TE. PREHEAT. RAMP-DOWN
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ICS‐40638
SOLDERING PROFILE
CRITICAL ZONE tP TL TO TP TP RAMP-UP E T R L T tL SMAX TU A R E T P SMIN M TE tS PREHEAT RAMP-DOWN t25°C TO PEAK TEMPERATURE TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Sn63/Pb37 Pb‐Free
Average Ramp Rate (TL to TP) 1.25°C/sec max 1.25°C/sec max Minimum Temperature 100°C 100°C (TSMIN) Preheat Maximum Temperature 150°C 200°C (TSMAX) Time (TSMIN to TSMAX), tS 60 sec to 75 sec 60 sec to 75 sec Ramp‐Up Rate (TSMAX to TL) 1.25°C/sec 1.25°C/sec Time Maintained Above Liquidous (tL) 45 sec to 75 sec ~50 sec Liquidous Temperature (TL) 183°C 217°C Peak Temperature (TP) 215°C +3°C/−3°C 260°C +0°C/−5°C Time Within +5°C of Actual Peak 20 sec to 30 sec 20 sec to 30 sec Temperature (tP) Ramp‐Down Rate 3°C/sec max 3°C/sec max Time +25°C (t25°C) to Peak Temperature 5 min max 5 min max
*Note:
The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J‐STD‐020 profile Page 5 of 14 Document Number: DS‐000281 Revision: 1.1
SOLDERING PROFILE
CRITICAL ZONE tP TL TO TP TP RAMP-UP E T R L T tL SMAX TU A R E T P SMIN M TE tS PREHEAT RAMP-DOWN t25°C TO PEAK TEMPERATURE TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Sn63/Pb37 Pb‐Free
Average Ramp Rate (TL to TP) 1.25°C/sec max 1.25°C/sec max Minimum Temperature 100°C 100°C (TSMIN) Preheat Maximum Temperature 150°C 200°C (TSMAX) Time (TSMIN to TSMAX), tS 60 sec to 75 sec 60 sec to 75 sec Ramp‐Up Rate (TSMAX to TL) 1.25°C/sec 1.25°C/sec Time Maintained Above Liquidous (tL) 45 sec to 75 sec ~50 sec Liquidous Temperature (TL) 183°C 217°C Peak Temperature (TP) 215°C +3°C/−3°C 260°C +0°C/−5°C Time Within +5°C of Actual Peak 20 sec to 30 sec 20 sec to 30 sec Temperature (tP) Ramp‐Down Rate 3°C/sec max 3°C/sec max Time +25°C (t25°C) to Peak Temperature 5 min max 5 min max
*Note:
The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J‐STD‐020 profile Page 5 of 14 Document Number: DS‐000281 Revision: 1.1