Datasheet BM90 (Microchip) - 9

FabricanteMicrochip
DescripciónBluetooth 3.0 Multi-Speaker Stereo Audio Module
Páginas / Página31 / 9 — BM90 Module. 4.0 SPECIFICATIONS 4.1 SPECIFICATIONS. Table 4-1: Absolute …
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BM90 Module. 4.0 SPECIFICATIONS 4.1 SPECIFICATIONS. Table 4-1: Absolute Maximum Specifications. Symbol. Parameter. Min. Max. Unit

BM90 Module 4.0 SPECIFICATIONS 4.1 SPECIFICATIONS Table 4-1: Absolute Maximum Specifications Symbol Parameter Min Max Unit

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BM90 Module 4.0 SPECIFICATIONS 4.1 SPECIFICATIONS Table 4-1: Absolute Maximum Specifications Symbol Parameter Min Max Unit
1V8 Digital core supply voltage 0 2.1 V VCC_RF RF supply voltage 0 2.1 V SAR_VDD SAR ADC supply voltage 0 2.1 V VDDA/VDDAO CODEC supply voltage 0 3.3 V VDD_IO I/O supply voltage 0 3.6 V BK_VDD BUCK supply voltage 0 4.3 V 3V1_IN LDO Supply voltage 0 4.3 V BAT_IN Input voltage for battery 0 4.3 V ADP_IN Input voltage for adaptor 0 7.0 V TSTORE Storage temperature -65 +150 ºC TOPERATION Operation temperature -20 +70 ºC
Table 4-2: Recommended operating condition Symbol Parameter Min Typical Max Unit
1V8 Digital core supply voltage 1.8 1.85 1.95 V VDD_IO I/O supply voltage 2.8 3.0 3.3 V BAT_IN Input voltage for battery 3 3.7 4.25 V ADP_IN Input voltage for adaptor 4.5 5 5.5 V *Absolute and Recommended operating condition tables reflect typical usage for device. *All these supply voltage are programmable by EEPROM parameters.
Table 4-3: Battery Charger Parameter Min Typical Max Unit
Input Voltage 4.5 5.0 5.5 V Battery trickle charge current 0.1C mA (BAT_IN < trickle charge voltage threshold) Headroom > 0.7V Maximum Battery 170 200 240 mA (ADAP_IN=5V) Fast Charge Current Note: ENX2=0 Headroom = 0.3V 160 180 240 mA (ADAP_IN=4.5V) Headroom > 0.7V Maximum Battery 330 350 420 mA (ADAP_IN=5V) Fast Charge Current Note: ENX2=1 Headroom = 0.3V 180 220 270 mA (ADAP_IN=4.5V) Trickle Charge Voltage Threshold 3 V Float Voltage 4.158 4.2 4.242 V Battery Charge Termination Current, 10 % (% of Fast Charge Current) Note: (1) C is set in EEPROM (2) Headroom = VADAP_IN – VBAT (3) ENX2 is not allowed to be enabled when VADAP_IN – VBAT > 2V (4) The Li-Ion battery has operation temperature limiting condition which is depended on vender.. (5)These parameters are characterized but not tested in manufacturing. page 9 Document Outline Bluetooth® 3.0 Multi-Speaker Stereo Audio Module Features Description Applications Table of Contents 1.0 DEVICE OVERVIEW FIGURE 1-1: APPLICATION BLOCK DIAGRAM Audio Interface FIGURE 1-2: Analog audio interface block diagram FIGURE 1-3: Twin Speaker Link block diagram 2.0 Key Features Table 3.0 PIN DESCRIPTION TABLE 3-1: BM90 PIN DESCRIPTION 4.0 SPECIFICATIONS 4.1 SPECIFICATIONS Table 4-1: Absolute Maximum Specifications Table 4-2: Recommended operating condition Table 4-3: Battery Charger Table 4-4: LED driver Table 4-5: Digital IO Table 4-6: Audio codec Digital to Analogue Converter Table 4-7: Audio codec Analogue to Digital Converter Table 4-8: Transmitter section for BDR Table 4-9: Transmitter section for EDR Table 4-10: Receiver section for BDR Table 4-11: Receiver section for EDR 4.2 PRINTED ANTENNA PERFORMANCE Table 4-12: Antenna Parameters FIGURE 4-1: Antenna 3D radiation pattern @2441 MHz 4.3 BQTF INFORMATION FIGURE 4-2: BQTF Information 4.4 CURRENT CONSUMPTION Table 4-13: Single Mode current consumption Table 4-14: Twin Mode: Master current consumption Table 4-15: Twin Mode: Slave current consumption 5.0 APPLICATIONS 5.1 EXTERNAL CONFIGURATION FIGURE 5-1: External Configuration Header Connections TABLE 5-1: SYSTEM CONFIGURATION SETTINGS 5.2 LED DRIVER 5.3 FUNCTION OF PIN TABLE 5-2: IOs for Buttons TABLE 5-3: IOs for added functions 5.4 Adaptive Frequency Hopping (AFH) 5.5 MULTI-SPEAKER 5.5.1 TWIN SPEAKER LINK TECHNOLOGY INTRODUCTION 5.5.1.1 TWIN SPEAKER LINK Figure 5-2 A2DP Twin Speaker Link Diagram 5.6 Mounting Details 5.7 Module Dimension FIGURE 5-3: BM90 module FIGURE 5-4: Outline Dimension FIGURE 5-5: Module Foot print 5.8 Main Board Antenna Area Layout Guide FIGURE 5-6: Mother Board Antenna Area Layout Guide 5.9 RFLOW PROFILE 5.9.1Soldering Recommendations FIGURE 5-7: Reflow profile 6.0 REFERENCE CIRCUIT FIGURE 6-1: BM90 reference circuit 7.0 PACKING INFORMATION 7.1 QR code label information 7.2 Storage standard 7.3 Ordering Information 7.4 Tray Dimensions 7.5 Packing Method