Preliminary Datasheet BM77SPPx3MC2 (Microchip)
Fabricante | Microchip |
Descripción | Bluetooth 4.0 Dual Mode Module |
Páginas / Página | 28 / 1 — 30077 新竹科學工業園區工業東七路5號5樓. 5F, No.5, Industry E. Rd. VII, Hsinchu Science … |
Formato / tamaño de archivo | PDF / 741 Kb |
Idioma del documento | Inglés |
30077 新竹科學工業園區工業東七路5號5樓. 5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C
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30077 新竹科學工業園區工業東七路5號5樓
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.
TEL : 886-3-577-8385 FAX : 886-3-577-8945
www.issc-tech.com BM77SPPx3MC2
Bluetooth® 4.0 Dual Mode Module
Features:
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• Complete, Fully Certified, Embedded 2.4 GHz
Bluetooth® Version 4.0 Module
Bluetooth Classic (BR/EDR) and Low Energy (LE)
Bluetooth SIG Certified
Onboard embedded Bluetooth Stack
Transparent UART mode for seamless serial data over
UART interface
Easy to configure with Windows GUI or direct by MCU
Firmware can be field upgradable via UART
Compact surface mount module: 22 x 12 x 2.4 mm
Castellated surface mount pads for easy and reliable
host PCB mounting
Environmentally friendly, RoHS compliant
Perfect for Portable Battery Operated Devices
Internal Battery Regulator Circuitry
Worldwide regulatory certifications FIGURE 1: Operational:
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• • Single operating voltage: 3.2V to 4.3V
Temperature range: -20 to 70°C
Simple, UART interface
Integrated crystal, internal voltage regulator, and
matching circuitry
Multiple I/O pins for control and status General Description: RF/Analog:
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• Frequency: 2.402 to 2.480 GHz
Receive Sensitivity: -90 dBm (Classic); -92 dBm (LE)
Power Output: 2 dBm (typ.) Data Throughput:
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• 50 kilobyte (Classic on Android)
8 kilobyte (LE on iOS7) MAC/Baseband/Higher Layer:
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• Secure AES128 encryption
GAP, SDP, SPP, GATT profiles Antenna:
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• Ceramic Chip Antenna (BM77SPPS3MC2)
External Antenna Connection via RF Pad
(BM77SPP03MC2) Compliance:
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• This Bluetooth SIG certified module provides a complete
wireless solution with Bluetooth stack onboard, integrated
antenna, and worldwide radio certifications in a compact
surface mount package, 22 x 12 x 2.4 mm. It supports GAP,
SDP, SPP, and GATT profiles. Data is transferred over the
Bluetooth link by sending/receiving data via transparent
UART mode, making it easy to integrate with any processor
or Microcontroller with a UART interface. Configuration is
made easy using a Windows® based GUI or directly via UART
by a MCU. Applications: Bluetooth SIG QDID: B021961
Modular Certified for the United States (FCC) and
Canada (IC)
European R&TTE Directive Assessed Radio Module
Australia, New Zealand, Korea, Taiwan, Japan © 2014 ISSC Technologies Corp. The BM77 is a fully-certified Bluetooth® Version 4.0
(BR/EDR/LE) module for designers who want to easily add
dual mode Bluetooth® wireless capability to their products.
Delivering local connectivity for the Internet of Things (IoT),
the BM77 bridges your product to Smart Phones and Tablets
for convenient data transfer, control and access to cloud
applications. •
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• Mobile Point of Sales (mPOS)
LED lighting
Wearables
Digital Sports
Fitness Devices
Health Care/ Medical
Automotive Accessories
Home Automation
Remote Control Toys Preliminary Revision 2.1.1 – June 16, 2015 Page 1