Datasheet ATBTLC1000-MR (Microchip) - 2

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ATBTLC1000-MR110CA
– 128 KB embedded ROM • Hardware Security Accelerators: – Advanced Encryption Standard (AES) - 128 – Secure Hash Algorithm (SHA) - 256 • Peripherals: – 12 digital and 1 wake-up GPIO(1) – Two Mixed signal GPIOs(1) – Programmable 96 kOhm pull up or pull-down resistor for each GPIO(1) – Retention capable GPIO pads(1) – One Serial Peripheral Interface (SPI) Master/Slave(1) – Two Inter-Integrated Circuit (I2C) Master/Slave(1) – Two UART(1) – One SPI Flash(1) – Three-axis quadrature decoder(1) – Four Pulse Width Modulation (PWM) channels, three General Purpose Timers, and one Wake- up Timer(1) – 2-channel 11-bit Analog-to-Digital Converter (ADC)(1) • Clock: – Integrated 26 MHz oscillator – 26 MHz crystal oscillator (XO) – Fully integrated sleep oscillator – 32 kHz Real Time Clock crystal oscillator (RTC XO) • Ultra-Low Power – 2.01 μA sleep current – 3.91 mA peak TX current(2) – 5.24 mA peak RX current – 15.1 μA average advertisement current(3) • Integrated Power Management: – 1.8V to 4.3V input range for PMU – 1.62V to 4.3V input range for I/O – Fully integrated Buck DC/DC converter • Temperature Range: -40°C to 85°C • Package: – 25-pin module package 12.700 mm x 20.152 mm
Note: 
1. Usage of this feature is not supported by the BluSDK. The datasheet will be updated once the support for this feature is added in BluSDK. 2. TX output power - 0 dBm 3. Advertisement channels - 3; Advertising interval - 1 second; Advertising event type - Connectable undirected; Advertisement data payload size - 31 octets. © 2019 Microchip Technology Inc.
Datasheet
DS70005393A-page 2 Document Outline Introduction Features Table of Contents 1. Ordering Information 2. Package Information 3. Block Diagram 4. Pinout Information 4.1. Pin Description 5. Device States 5.1. Description of Device States 5.2. Controlling the Device States 6. Host Microcontroller Interface 7. Clocking 7.1. 26 MHz Crystal Oscillator (XO) 7.2. 32.768 kHz RTC Crystal Oscillator (RTC XO) 7.2.1. General Information 7.2.2. RTC XO Design and Interface Specification 7.2.3. RTC Characterization with Gm Code Variation 7.2.4. RTC Characterization with Supply Variation and Temperature 7.3. 2 MHz and 26 MHz Integrated RC Oscillators 8. Electrical Characteristics 8.1. Absolute Maximum Ratings 8.2. Recommended Operating Conditions 8.3. Current Consumption in Device States 8.4. Receiver Performance 8.5. Transmitter Performance 9. ATBTLC1000-MR110CA Module Outline Drawing 10. ATBTLC1000-MR110CA Reference Schematic 10.1. Reference Schematics 11. Placement and Routing Guidelines 11.1. Power and Ground 11.2. Interferers 12. Reflow Profile Information 12.1. Storage Condition 12.1.1. Moisture Barrier Bag Before Opening 12.1.2. Moisture Barrier Bag Open 12.2. Stencil Design 12.3. Soldering and Reflow Condition 12.3.1. Reflow Oven 12.4. Baking Conditions 12.5. Module Assembly Considerations 13. Regulatory Approval 13.1. United States (FCC) 13.1.1. Labeling And User Information Requirements 13.1.2. RF Exposure 13.1.3. Helpful Websites 13.2. Canada (ISED) 13.2.1. Labeling and User Information Requirements 13.2.2. RF Exposure 13.2.3. Helpful Websites 13.3. Japan 13.3.1. Labeling and User Information Requirements 13.3.2. Helpful Websites 13.4. Other Regulatory Information 14. Reference Documentation 15. Document Revision History The Microchip Web Site Customer Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service