Datasheet LTM8025 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 36V, 3A Step-Down µModule Regulator |
| Páginas / Página | 22 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION. ORDER INFORMATION. … |
| Revisión | D |
| Formato / tamaño de archivo | PDF / 974 Kb |
| Idioma del documento | Inglés |
ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION. ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
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LTM8025
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, RUN/SS Voltage ...36V BIAS ..25V ADJ, RT, SHARE Voltage ...6V VIN + BIAS ...56V VOUT, AUX ...25V Maximum Junction Temperature (Note 2) .. 125°C PGOOD, SYNC...30V Solder Temperature ... 245°C
PIN CONFIGURATION
TOP VIEW TOP VIEW 1 2 3 4 5 6 7 1 2 3 4 5 6 7 V V OUT GND OUT GND A A B B BANK 1 BANK 1 C C D D E E F F BANK 2 BANK 2 G RT G RT H AUX SHARE AUX H SHARE BIAS J PGOOD BIAS J PGOOD K ADJ BANK 3 K ADJ L BANK 3 L VIN RUN/SS SYNC VIN RUN/SS SYNC LGA PACKAGE BGA PACKAGE 70-PIN (9mm × 15mm × 4.32mm) 70-PIN (9mm × 15mm × 4.92mm TJMAX = 125°C, θJA = 24.4°C/W, θJC(BOTTOM) = 11.5°C/W, TJMAX = 125°C, θJA = 24.4°C/W, θJC(BOTTOM) = 11.5°C/W, θJC(TOP) = 42.7°C/W, θJB = 18.7°C/W θJC(TOP) = 42.7°C/W, θJB = 18.7°C/W θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER WEIGHT = 1.8 GRAMS WEIGHT = 1.8 GRAMS)
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (NOTE 2)
LTM8025EV#PBF Au (RoHS) LTM8025V e4 LGA 3 –40°C to 125°C LTM8025IV#PBF Au (RoHS) LTM8025V e4 LGA 3 –40°C to 125°C LTM8025MPV#PBF Au (RoHS) LTM8025MPV e4 LGA 3 –55°C to 125°C LTM8025EY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –40°C to 125°C LTM8025IY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –40°C to 125°C LTM8025IY SnPb (63/37) LTM8025Y e0 BGA 3 –40°C to 125°C LTM8025MPY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –55°C to 125°C LTM8025MPY SnPb (63/37) LTM8025Y e0 BGA 3 –55°C to 125°C • Contact the factory for parts specified with wider operating temperature ranges. • Recommended LGA and BGA PCB Assembly and *Pad or ball finish code is per IPC/JEDEC J-STD-609. Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. D 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Package Photography Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, RUN/SS Voltage ...36V BIAS ..25V ADJ, RT, SHARE Voltage ...6V VIN + BIAS ...56V VOUT, AUX ...25V Maximum Junction Temperature (Note 2) .. 125°C PGOOD, SYNC...30V Solder Temperature ... 245°C
PIN CONFIGURATION
TOP VIEW TOP VIEW 1 2 3 4 5 6 7 1 2 3 4 5 6 7 V V OUT GND OUT GND A A B B BANK 1 BANK 1 C C D D E E F F BANK 2 BANK 2 G RT G RT H AUX SHARE AUX H SHARE BIAS J PGOOD BIAS J PGOOD K ADJ BANK 3 K ADJ L BANK 3 L VIN RUN/SS SYNC VIN RUN/SS SYNC LGA PACKAGE BGA PACKAGE 70-PIN (9mm × 15mm × 4.32mm) 70-PIN (9mm × 15mm × 4.92mm TJMAX = 125°C, θJA = 24.4°C/W, θJC(BOTTOM) = 11.5°C/W, TJMAX = 125°C, θJA = 24.4°C/W, θJC(BOTTOM) = 11.5°C/W, θJC(TOP) = 42.7°C/W, θJB = 18.7°C/W θJC(TOP) = 42.7°C/W, θJB = 18.7°C/W θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER WEIGHT = 1.8 GRAMS WEIGHT = 1.8 GRAMS)
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (NOTE 2)
LTM8025EV#PBF Au (RoHS) LTM8025V e4 LGA 3 –40°C to 125°C LTM8025IV#PBF Au (RoHS) LTM8025V e4 LGA 3 –40°C to 125°C LTM8025MPV#PBF Au (RoHS) LTM8025MPV e4 LGA 3 –55°C to 125°C LTM8025EY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –40°C to 125°C LTM8025IY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –40°C to 125°C LTM8025IY SnPb (63/37) LTM8025Y e0 BGA 3 –40°C to 125°C LTM8025MPY#PBF SAC305 (RoHS) LTM8025Y e1 BGA 3 –55°C to 125°C LTM8025MPY SnPb (63/37) LTM8025Y e0 BGA 3 –55°C to 125°C • Contact the factory for parts specified with wider operating temperature ranges. • Recommended LGA and BGA PCB Assembly and *Pad or ball finish code is per IPC/JEDEC J-STD-609. Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. D 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Package Photography Typical Application Related Parts