Datasheet LTM4625 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 20VIN, 5A Step-Down DC/DC μModule (Power Module) Regulator |
| Páginas / Página | 26 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin … |
| Revisión | D |
| Formato / tamaño de archivo | PDF / 1.6 Mb |
| Idioma del documento | Inglés |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin Functions, Pin Configuration T. able). ORDER INFORMATION
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ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration T able)
VIN, SVIN .. –0.3V to 22V TOP VIEW RUN ... –0.3V to 22V CLKOUT PGOOD, MODE, TRACK/SS, FREQ, PHMODE, CLKIN SVIN CLKIN ..–0.3V to INTVCC 5 VIN SGND Internal Operating Temperature Range MODE FREQ 4 INTVCC (Notes 2, 5) .. –40°C to 125°C RUN 3 GND Storage Temperature Range .. –65°C to 150°C PHMODE TRACK/SS PGOOD 2 Peak Solder Reflow Body Temperature ... 245°C FB VOUT COMP 1 A B C D E BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 5.01mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θ VALUES DETERMINED PER JESD51-12, WEIGHT = 0.5g
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4625EY#PBF SAC305 (RoHS) LTM4625Y e1 BGA 3 –40°C to 125°C LTM4625IY#PBF SAC305 (RoHS) LTM4625Y e1 BGA 3 –40°C to 125°C LTM4625IY SnPb (63/37) LTM4625Y e0 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = SVIN = 12V per the typical application shown on the front page. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Regulator Section: per Channel
VIN Input DC Voltage SVIN = VIN l 4 20 V VOUT Output Voltage Range l 0.6 5.5 V VOUT(DC) Output Voltage, Total CIN = 22µF, COUT = 100µF Ceramic, RFB = 40.2k, Variation with Line and Load MODE = INTVCC, IOUT = 0A to 5A (Note 3) –40°C to 125°C l 1.477 1.50 1.523 V VRUN RUN Pin On Threshold VRUN Rising 1.1 1.2 1.3 V IQ(SVIN) Input Supply Bias Current VIN = 12V, VOUT = 1.5V, MODE = INTVCC 6 mA VIN = 12V, VOUT = 1.5V, MODE = GND 2 mA Shutdown, RUN = 0, VIN = 12V 11 µA IS(VIN) Input Supply Current VIN = 12V, VOUT = 1.5V, IOUT = 5A 0.75 A Rev D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration T able)
VIN, SVIN .. –0.3V to 22V TOP VIEW RUN ... –0.3V to 22V CLKOUT PGOOD, MODE, TRACK/SS, FREQ, PHMODE, CLKIN SVIN CLKIN ..–0.3V to INTVCC 5 VIN SGND Internal Operating Temperature Range MODE FREQ 4 INTVCC (Notes 2, 5) .. –40°C to 125°C RUN 3 GND Storage Temperature Range .. –65°C to 150°C PHMODE TRACK/SS PGOOD 2 Peak Solder Reflow Body Temperature ... 245°C FB VOUT COMP 1 A B C D E BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 5.01mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θ VALUES DETERMINED PER JESD51-12, WEIGHT = 0.5g
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4625EY#PBF SAC305 (RoHS) LTM4625Y e1 BGA 3 –40°C to 125°C LTM4625IY#PBF SAC305 (RoHS) LTM4625Y e1 BGA 3 –40°C to 125°C LTM4625IY SnPb (63/37) LTM4625Y e0 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = SVIN = 12V per the typical application shown on the front page. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Regulator Section: per Channel
VIN Input DC Voltage SVIN = VIN l 4 20 V VOUT Output Voltage Range l 0.6 5.5 V VOUT(DC) Output Voltage, Total CIN = 22µF, COUT = 100µF Ceramic, RFB = 40.2k, Variation with Line and Load MODE = INTVCC, IOUT = 0A to 5A (Note 3) –40°C to 125°C l 1.477 1.50 1.523 V VRUN RUN Pin On Threshold VRUN Rising 1.1 1.2 1.3 V IQ(SVIN) Input Supply Bias Current VIN = 12V, VOUT = 1.5V, MODE = INTVCC 6 mA VIN = 12V, VOUT = 1.5V, MODE = GND 2 mA Shutdown, RUN = 0, VIN = 12V 11 µA IS(VIN) Input Supply Current VIN = 12V, VOUT = 1.5V, IOUT = 5A 0.75 A Rev D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts