Datasheet ADuCM3027, ADuCM3029 (Analog Devices) - 4

ADuCM3027 /ADuCM3029 Data Sheet SPECIFICATIONS OPERATING CONDITIONS AND ELECTRICAL CHARACTERISTICS Table 2. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
EXTERNAL BATTERY SUPPLY VOLTAGE1, 2 VBAT 1.74 3.0 3.6 V INPUT VOLTAGE High Level VIH 2.5 V VBAT = 3.6 V Low Level VIL 0.45 V VBAT = 1.74 V ADC SUPPLY VOLTAGE VBAT_ADC 1.74 3.0 3.6 V OUTPUT VOLTAGE3 High Level VOH 1.4 V VBAT = 1.74 V, IOH = −1.0 mA Low Level VOL 0.4 V VBAT = 1.74 V, IOL = 1.0 mA INPUT CURRENT PULL-UP4 High Level IIHPU 0.01 0.2 µA VBAT = 3.6 V, VIN = 3.6 V Low Level IILPU 100 µA VBAT =3.6 V, VIN = 0 V THREE-STATE LEAKAGE CURRENT High Level5 IOZH 0.01 0.15 µA VBAT = 3.6 V, VIN = 3.6 V Pull-Up6 IOZHPU 0.30 µA VBAT = 3.6 V, VIN = 3.6 V Pull-Down7 IOZHPD 100 µA VBAT = 3.6 V, VIN = 3.6 V Low Level5 IOZL 0.01 0.15 µA VBAT = 3.6 V, VIN = 0 V Pull-Up6 IOZLPU 100 µA VBAT = 3.6 V, VIN = 0 V Pull-Down7 IOZLPD 0.15 µA VBAT = 3.6 V, VIN = 0 V INPUT CAPACITANCE CIN 10 pF TJ = 25°C JUNCTION TEMPERATURE TJ −40 +85 °C TAMBIENT = -40°C to +85°C 1 Value applies to VBAT_ANA1, VBAT_ANA2, VBAT_DIG1, and VBAT_DIG2 pins. 2 Must remain powered (even if the associated function is not used). 3 Applies to the output and bidirectional pins: P0_00 to P0_15, P1_00 to P1_15, and P2_00 to P2_11. 4 Applies to the SYS_HWRST input pin with pull-up. 5 Applies to the three-state pins: P0_00 to P0_05, P0_08 to P0_15, P1_00 to P1_15, and P2_00 to P2_11. 6 Applies to the three-state pins with pull-ups: P0_00 to P0_05, P0_07 to P0_15, and P1_00 to P1_11. 7 Applies to the P0_06 three-state pin with pull-down.
EMBEDDED FLASH SPECIFICATIONS Table 3. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FLASH Endurance 10,000 Cycles Data Retention 10 Years Rev. B | Page 4 of 39 Document Outline Features Applications Functional Block Diagram Revision History General Description Product Highlights Specifications Operating Conditions and Electrical Characteristics Embedded Flash Specifications Power Supply Current Specifications Active Mode Flexi Mode Deep Sleep Modes—VBAT = 3.0 V ADC Specifications System Clocks External Crystal Oscillator Specifications On-Chip RC Oscillator Specifications System Clocks and PLL Specifications Timing Specifications Reset Timing Serial Ports Timing SPI Timing I2C Specifications General-Purpose Port Timing RTC1 (FLEX_RTC) Specifications Timer Pulse-Width Modulation (PWM) Output Cycle Timing Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation ARM Cortex-M3 Processor ARM Cortex-M3 Memory Subsystem Code Region SRAM Region System Region Memory Architecture SRAM Region MMRs (Peripheral Control and Status) Flash Memory Cache Controller System and Integration Features Reset Booting Power Management Power Modes Active Mode Flexi Mode Hibernate Mode Shutdown Mode Security Features Cryptographic Accelerator True Random Number Generator (TRNG) Reliability and Robustness Features ECC Enabled Flash Memory Multiparity Bit Protected SRAM Software Watchdog Cyclic Redundancy Check (CRC) Accelerator Programmable GPIOs Timers General-Purpose Timers Watchdog Timer (WDT) Analog-to-Digital Converter (ADC) Subsystem Clocking Beeper Driver Debug Capability On-Chip Peripheral Features Serial Ports (SPORT) SPI Ports UART Port I2C Development Support Documentation Hardware Software Additional Information Reference Designs MCU Test Conditions Driver Types EEMBC ULPMark™-CP Score GPIO Multiplexing Applications Information About ADuCM3027/ADuCM3029 Silicon Anomalies Functionality Issues Outline Dimensions Ordering Guide