Datasheet AD5592R (Analog Devices) - 9
| Fabricante | Analog Devices |
| Descripción | 8 Channel, 12-Bit, Configurable ADC/DAC with on-chip Reference, SPI interface |
| Páginas / Página | 43 / 9 — Data Sheet. AD5592R. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| Revisión | E |
| Formato / tamaño de archivo | PDF / 984 Kb |
| Idioma del documento | Inglés |
Data Sheet. AD5592R. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 5. Parameter. Rating. Table 6. Thermal Resistance
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Data Sheet AD5592R ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
THERMAL RESISTANCE
100 mA do not cause SCR latch-up. θJA is specified for the worst-case conditions, that is, a device
Table 5.
soldered in a circuit board for surface-mount packages.
Parameter Rating Table 6. Thermal Resistance
VDD to GND −0.3 V to + 7 V
Package Type θJA Unit
VLOGIC to GND −0.3 V to + 7 V 16-Ball WLCSP 60 °C/W Analog Input Voltage to GND −0.3 V to VDD + 0.3 V 16-Lead LFCSP 137 °C/W AD5592R 16-Lead TSSOP 112 °C/W Digital Input Voltage to GND −0.3 V to VDD + 0.3 V Digital Output Voltage to GND −0.3 V to V DD + 0.3 V AD5592R-1
ESD CAUTION
Digital Input Voltage to GND −0.3 V to VLOGIC + 0.3 V Digital Output Voltage to GND −0.3 V to VLOGIC + 0.3 V VREF to GND −0.3 V to VDD + 0.3 V Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature (T J max) 150°C Lead Temperature JEDEC industry standard Soldering J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 9 of 43 Document Outline Features Applications General Description Functional Block Diagram Revision History Functional Block Diagram (AD5592R-1) Specifications Timing Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Terminology ADC Terminology DAC Terminology Theory of Operation DAC Section Resistor String Output Buffer ADC Section Calculating ADC Input Current GPIO Section Internal Reference RESETB Function Temperature Indicator Serial Interface Power-Up Time Write Mode Read Mode Configuring the AD5592R/AD5592R-1 General-Purpose Control Register DAC Write Operation LDAC Mode Operation DAC Readback ADC Operation Changing an ADC Sequence GPIO Operation Setting Pins as Outputs Setting Pins as Inputs Three-State Pins 85 kΩ Pull-Down Resistor Pins Power-Down Mode Reset Function Readback and LDAC Mode Register Applications Information Microprocessor Interfacing AD5592R/AD5592R-1 to SPI Interface AD5592R/AD5592R-1 to SPORT Interface Layout Guidelines Outline Dimensions Ordering Guide
TA = 25°C, unless otherwise noted. Transient currents of up to
THERMAL RESISTANCE
100 mA do not cause SCR latch-up. θJA is specified for the worst-case conditions, that is, a device
Table 5.
soldered in a circuit board for surface-mount packages.
Parameter Rating Table 6. Thermal Resistance
VDD to GND −0.3 V to + 7 V
Package Type θJA Unit
VLOGIC to GND −0.3 V to + 7 V 16-Ball WLCSP 60 °C/W Analog Input Voltage to GND −0.3 V to VDD + 0.3 V 16-Lead LFCSP 137 °C/W AD5592R 16-Lead TSSOP 112 °C/W Digital Input Voltage to GND −0.3 V to VDD + 0.3 V Digital Output Voltage to GND −0.3 V to V DD + 0.3 V AD5592R-1
ESD CAUTION
Digital Input Voltage to GND −0.3 V to VLOGIC + 0.3 V Digital Output Voltage to GND −0.3 V to VLOGIC + 0.3 V VREF to GND −0.3 V to VDD + 0.3 V Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature (T J max) 150°C Lead Temperature JEDEC industry standard Soldering J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 9 of 43 Document Outline Features Applications General Description Functional Block Diagram Revision History Functional Block Diagram (AD5592R-1) Specifications Timing Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Terminology ADC Terminology DAC Terminology Theory of Operation DAC Section Resistor String Output Buffer ADC Section Calculating ADC Input Current GPIO Section Internal Reference RESETB Function Temperature Indicator Serial Interface Power-Up Time Write Mode Read Mode Configuring the AD5592R/AD5592R-1 General-Purpose Control Register DAC Write Operation LDAC Mode Operation DAC Readback ADC Operation Changing an ADC Sequence GPIO Operation Setting Pins as Outputs Setting Pins as Inputs Three-State Pins 85 kΩ Pull-Down Resistor Pins Power-Down Mode Reset Function Readback and LDAC Mode Register Applications Information Microprocessor Interfacing AD5592R/AD5592R-1 to SPI Interface AD5592R/AD5592R-1 to SPORT Interface Layout Guidelines Outline Dimensions Ordering Guide