Datasheet ZSSC3240 (Renesas) - 8
| Fabricante | Renesas |
| Descripción | Sensor Signal Conditioner IC for Resistive Sensors |
| Páginas / Página | 64 / 8 — ZSSC3240. 3. Absolute Maximum Ratings. Table 2. Absolute Maximum Ratings. … |
| Revisión | 20200414 |
| Formato / tamaño de archivo | PDF / 1.2 Mb |
| Idioma del documento | Inglés |
ZSSC3240. 3. Absolute Maximum Ratings. Table 2. Absolute Maximum Ratings. Symbol. Parameter. Conditions. Minimum. Maximum. Units
Línea de modelo para esta hoja de datos
Versión de texto del documento
link to page 8 link to page 8 link to page 8 link to page 8 link to page 8
ZSSC3240 3. Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device. Functional operation of the ZSSC3240 at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions might affect device reliability.
Table 2. Absolute Maximum Ratings Symbol Parameter Conditions Minimum Maximum Units
TJ Junction temperature 135 °C TS Storage temperature -45 150 °C ESD – Human Body Model 4000 V ESD – Charged Device Model 750 V Latch-up -100 +100 mA VDD_max Maximum allowed for voltage supply Referenced to VSS. -0.3 6.5 V VIF_max Voltage at digital interface pins I2C pins: SDA, SCL -0.3 5.5 V 4mA to 20mA current loop VFB_max Voltage at FB pin -2 2 V interface
4. Recommended Operating Conditions Table 3. Recommended Operating Conditions Symbol Parameter Minimum Typical Maximum Units
VDD Power supply voltage 2.7 – 5.5 V TA Ambient temperature (depending on the part code) -40 – 125 °C External (parasitic) capacitance between VDD and VSS, 0 10 – without external supply transistor regulation CVDD nF External (parasitic) capacitance between VDD and VSS, with 80 100 120 (optional) external supply transistor regulation Recommended, external capacitance between VDDB and CVDDB,EMC 0 6.8 8 nF VSS for electro-magnetic immunity (EMI) Recommended, external capacitance between AOUT versus CAOUT,EMC 0 22 33 nF VSS, and versus VDD for EMI [a] ISensor Load current through external sensor element [b] 0.02 0.5 4 mA External temperature diode and RTD input range, drop over VDioDrop -0.2 – 1 V external element referenced to TEXT pin VSens_in Absolute sensor signal input level, INN, INP pins 0.5 – 1.2 V VDDBratio_min Minimum level at VDDB [b] 0.9 – – V VSSBratio_max Maximum level at VSSB [b] - – 0.7 V Imax_AOUT_V Maximum current load at AOUT pin for voltage outputs - - 18 mA SRVDD_POR Recommended VDD rise slew rate for power-on-reset (POR) [c] 1.5 – – V/ms [a] For applications with OWI-interface or analog voltage-output. [b] With ratiometric sensor supply configuration; e.g. a ratiometric bridge or bridge as temperature sensor with internal or external Rt. [c] Per design, there is no (theoretical) minimum VDD slew rate to trigger a clean POR. Nevertheless, a reasonable slew rate is recommended.
5. Electrical Characteristics
All parameter values are valid only under specified operating conditions. All voltages are referenced to VSS.
Table 4. Electrical Characteristics
Note: See important notes at the end of this table.
Symbol Parameter Conditions Minimum Typical Maximum Units IC Supply
Current consumption, Excluding connected sensor elements – 2.3 2.80 mA IIC active IC (with LDOctrl enabled) Idle current consumption, Typical value at 30°C, maximum value at – 1.5 6 µA IIDLE IC in Idle State 85°C (125°C) (22) OWI and LDOctrl disabled Apr.15.20 Page 8 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Recommended Operating Conditions 5. Electrical Characteristics 6. Device Description 6.1 Signal Flow 6.2 Analog (Sensor) Front-End 6.2.1. Programmable-Gain Amplifier (PGA) 6.2.2. Analog-to-Digital Converter (ADC) 6.2.3. Internal Temperature Sensor 6.2.4. Supported Supplies for Sensor Elements and Additional, External Temperature Sensing 6.3 On-Chip Diagnostics 6.4 Digital Interfaces 6.4.1. SPI 6.4.2. I2C 6.4.3. One-Wire-Interface, OWI 6.5 Measurement and Output Options 6.5.1. Single Measurements, Digital Raw Results, and SSC Results 6.5.2. Cyclic, Continuous, Repeated Measurements – Measurement Scheduler 6.5.3. Analog Outputs: Digital-to-Analog Converter (DAC) 6.5.4. Output Interrupt Signaling 6.6 System Setup and Control 6.6.1. Digital Commands 6.6.2. Nonvolatile Memory (NVM) 6.6.3. Digital Sensor-Signal-Conditioning Mathematics 6.7 External, Extra LDO (LDOctrl) for Applications for > 5.5V 7. Calibration 8. Package Outline Drawings 9. Marking Diagram 10. Ordering Information 11. Glossary 12. Revision History
ZSSC3240 3. Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device. Functional operation of the ZSSC3240 at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions might affect device reliability.
Table 2. Absolute Maximum Ratings Symbol Parameter Conditions Minimum Maximum Units
TJ Junction temperature 135 °C TS Storage temperature -45 150 °C ESD – Human Body Model 4000 V ESD – Charged Device Model 750 V Latch-up -100 +100 mA VDD_max Maximum allowed for voltage supply Referenced to VSS. -0.3 6.5 V VIF_max Voltage at digital interface pins I2C pins: SDA, SCL -0.3 5.5 V 4mA to 20mA current loop VFB_max Voltage at FB pin -2 2 V interface
4. Recommended Operating Conditions Table 3. Recommended Operating Conditions Symbol Parameter Minimum Typical Maximum Units
VDD Power supply voltage 2.7 – 5.5 V TA Ambient temperature (depending on the part code) -40 – 125 °C External (parasitic) capacitance between VDD and VSS, 0 10 – without external supply transistor regulation CVDD nF External (parasitic) capacitance between VDD and VSS, with 80 100 120 (optional) external supply transistor regulation Recommended, external capacitance between VDDB and CVDDB,EMC 0 6.8 8 nF VSS for electro-magnetic immunity (EMI) Recommended, external capacitance between AOUT versus CAOUT,EMC 0 22 33 nF VSS, and versus VDD for EMI [a] ISensor Load current through external sensor element [b] 0.02 0.5 4 mA External temperature diode and RTD input range, drop over VDioDrop -0.2 – 1 V external element referenced to TEXT pin VSens_in Absolute sensor signal input level, INN, INP pins 0.5 – 1.2 V VDDBratio_min Minimum level at VDDB [b] 0.9 – – V VSSBratio_max Maximum level at VSSB [b] - – 0.7 V Imax_AOUT_V Maximum current load at AOUT pin for voltage outputs - - 18 mA SRVDD_POR Recommended VDD rise slew rate for power-on-reset (POR) [c] 1.5 – – V/ms [a] For applications with OWI-interface or analog voltage-output. [b] With ratiometric sensor supply configuration; e.g. a ratiometric bridge or bridge as temperature sensor with internal or external Rt. [c] Per design, there is no (theoretical) minimum VDD slew rate to trigger a clean POR. Nevertheless, a reasonable slew rate is recommended.
5. Electrical Characteristics
All parameter values are valid only under specified operating conditions. All voltages are referenced to VSS.
Table 4. Electrical Characteristics
Note: See important notes at the end of this table.
Symbol Parameter Conditions Minimum Typical Maximum Units IC Supply
Current consumption, Excluding connected sensor elements – 2.3 2.80 mA IIC active IC (with LDOctrl enabled) Idle current consumption, Typical value at 30°C, maximum value at – 1.5 6 µA IIDLE IC in Idle State 85°C (125°C) (22) OWI and LDOctrl disabled Apr.15.20 Page 8 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Recommended Operating Conditions 5. Electrical Characteristics 6. Device Description 6.1 Signal Flow 6.2 Analog (Sensor) Front-End 6.2.1. Programmable-Gain Amplifier (PGA) 6.2.2. Analog-to-Digital Converter (ADC) 6.2.3. Internal Temperature Sensor 6.2.4. Supported Supplies for Sensor Elements and Additional, External Temperature Sensing 6.3 On-Chip Diagnostics 6.4 Digital Interfaces 6.4.1. SPI 6.4.2. I2C 6.4.3. One-Wire-Interface, OWI 6.5 Measurement and Output Options 6.5.1. Single Measurements, Digital Raw Results, and SSC Results 6.5.2. Cyclic, Continuous, Repeated Measurements – Measurement Scheduler 6.5.3. Analog Outputs: Digital-to-Analog Converter (DAC) 6.5.4. Output Interrupt Signaling 6.6 System Setup and Control 6.6.1. Digital Commands 6.6.2. Nonvolatile Memory (NVM) 6.6.3. Digital Sensor-Signal-Conditioning Mathematics 6.7 External, Extra LDO (LDOctrl) for Applications for > 5.5V 7. Calibration 8. Package Outline Drawings 9. Marking Diagram 10. Ordering Information 11. Glossary 12. Revision History