VL53L3CXRanging sequence2.9Ranging sequenceFigure 8. Ranging sequence2.10Handshake management Once a ranging measurement is available, an interrupt is generated. This is communicated to the host as a physical signal on the GPIO1 pin, which is driven low, and the output of a driver function. The former operating method is called “hardware interrupt”, and the latter is referred as “polling mode”. Once the host reads the result, the interrupt is cleared by the driver and the ranging sequence can repeat. If the interrupt is not cleared, the ranging operation inside the VL53L3CX is on hold. The interrupt behavior allows a good synchronization between the VL53L3CX and the host, avoids losing results if the host is not available to acquire or process the data. It is strongly recommended to use the hardware interrupt pin to manage this handshake. For more details please refer to the device driver user manual. DS13204 - Rev 2page 10/35 Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents