Datasheet VL53L3CX (STMicroelectronics) - 7

FabricanteSTMicroelectronics
DescripciónTime-of-Flight ranging sensor with multi target detection
Páginas / Página35 / 7 — VL53L3CX. State machine description. 2.2. Figure 5. Device state machine. …
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VL53L3CX. State machine description. 2.2. Figure 5. Device state machine. 2.3. Customer manufacturing calibration flow. 2.4

VL53L3CX State machine description 2.2 Figure 5 Device state machine 2.3 Customer manufacturing calibration flow 2.4

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VL53L3CX State machine description 2.2 State machine description
The figure below shows the device state machine.
Figure 5. Device state machine
Power Off Host applies AVDD Host removes AVDD HW Standby Host raises XSHUT Host lowers XSHUT Initial Boot Automatic move SW Standby Host initiates START Self-Calibration Automatic move Continuous Next range starts Host initiates STOP Ranging automatically after Host has cleared the interrupt Host clears interrupt
2.3 Customer manufacturing calibration flow
Up to three calibrations are needed to guarantee the best sensor performances. Offset and RefSpad calibration are needed in all applications. If a cover glass is used, the crosstalk calibration is needed also. “Generic shape” crosstalk calibration is also available. In this case, part-to-part calibration is not needed and a standard set of calibration values is loaded. The detailed procedure is provided in the device driver user manual.
2.4 Device programming and control
The VL53L3CX physical control interface is I2C, described in Section 3 Control interface. A software layer (driver) is provided to control the device. This avoids complex I2C register operations with turnkey functions to start, stop and read the ranging values. The driver structure and functions are described in the device driver user manual.
DS13204
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Rev 2 page 7/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents