Datasheet ADP1031 (Analog Devices) - 4
Fabricante | Analog Devices |
Descripción | Three-Channel, Isolated Micropower Management Unit with Seven Digital Isolators |
Páginas / Página | 38 / 4 — ADP1031. Data Sheet. Parameter. Symbol. Min. Typ. Max. Unit. Test … |
Revisión | A |
Formato / tamaño de archivo | PDF / 1.5 Mb |
Idioma del documento | Inglés |
ADP1031. Data Sheet. Parameter. Symbol. Min. Typ. Max. Unit. Test Conditions/Comments
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ADP1031 Data Sheet Parameter Symbol Min Typ Max Unit Test Conditions/Comments
THERMAL SHUTDOWN Threshold TSHDN 150 °C Hysteresis THYS 15 °C PRECISION ENABLE Rising Input Threshold VEN_RISING 1.10 1.135 1.20 V Input Hysteresis VEN_HYST 100 mV Leakage Current 0.03 0.5 µA VEN = VINP POWER GOOD Power-Good Threshold Flyback Regulator Lower Limit VPG_FLYBACK_LL 87.5 90 92.5 % Fixed and adjustable output versions Upper Limit VPG_FYLBACK_UL 107.5 110 112.5 % Fixed and adjustable output versions Buck Regulator Lower Limit VPG_BUCK_LL 87.5 90 92.5 % Upper Limit VPG_BUCK_UL 107.5 110 112.5 % Inverting Regulator Lower Limit VPG_INVERTER_LL 87.5 90 92.5 % Upper Limit VPG_INVERTER_UL 107.5 110 112.5 % Glitch Rejection 1.36 µs Glitch of ±15% of the typical output Output Voltage Logic High VPWRGD_OH VMVDD − V PWRGD current (IPWRGD) = −1 mA 0.4 Logic Low VPWRGD_OL 0.4 V IPWRGD = 1 mA SLEW Voltage Level Threshold Slow Slew Rate 0.8 V Normal Slew Rate 2 V Input Current Slow Slew Rate −10 µA Slew voltage (VSLEW) = 0 V to 0.8 V Normal Slew Rate 10 µA VSLEW = 2 V to VINP Fast Slew Rate −1 +1 µA SLEW pin not connected CLOCK SYNCHRONIZATION SYNC Input Input Clock Range fSYNC 350 750 kHz Minimum On Pulse Width tSYNC_MIN_ON 100 ns Minimum Off Pulse Width tSYNC_MIN_OFF 150 ns High Logic VH (SYNC) 1.3 V Low Logic VL (SYNC) 0.4 V Leakage Current −1 0.005 1 µA SYNC voltage (VSYNC) = VSVDDx FLYBACK REGULATOR Output Voltage Range VOUT1 (ADJ) 6 28 V ADP1031ACPZ-1, ADP1031ACPZ-2, and ADP1031ACPZ-3 VOUT1 (FIXED) 24 V ADP1031ACPZ-4 VOUT1 (FIXED) 21 V ADP1031ACPZ-5 Output Voltage Accuracy −1.5 +1.5 % Fixed output options Rev. A | Page 4 of 38 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT COMPANION PRODUCTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS REGULATORY INFORMATION ELECTROMAGNECTIC COMPATIBILITY INSULATION AND SAFETY RELATED SPECIFICATIONS DIN V VDE 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION FLYBACK REGULATOR Flyback Regulator Operation Power Saving Mode (PSM) Flyback Undervoltage Lockout (UVLO) Flyback Regulator Precision Enable Control Flyback Regulator Soft Start Flyback Slew Rate Control Flyback Regulator Overcurrent Protection Flyback Regulator Overvoltage Protection BUCK REGULATOR Buck Regulator Operation Buck Regulator UVLO Buck Regulator Soft Start Buck Regulator Current-Limit Protection Buck Regulator OVP Buck Regulator Active Pull-Down Resistor INVERTING REGULATOR Inverting Regulator Operation Inverting Regulator UVLO Inverting Regulator Soft Start Inverting Regulator Current-Limit Protection Inverting Regulator OVP Inverting Regulator Active Pull-Down Resistor POWER GOOD POWER-UP SEQUENCE OSCILLATOR AND SYNCHRONIZATION THERMAL SHUTDOWN DATA ISOLATION High Speed SPI Channels GPIO Data Channels APPLICATIONS INFORMATION COMPONENT SELECTION Feedback Resistors Capacitor Selection FLYBACK REGULATOR COMPONENTS SELECTION Input Capacitor Output Capacitor Ripple Current vs. Capacitor Value Schottky Diode Transformer Turn Ratio Primary Inductance Flyback Transformer Saturation Current Series Winding Resistance Leakage Inductance and Clamping Circuits Clamping Resistor Clamping Capacitor Clamping Diode Diode Zener Diode Clamp Ripple Current (IAC) vs. Inductance Maximum Output Current Calculation BUCK REGULATOR COMPONENTS SELECTION Inductor Output Capacitor INVERTING REGULATOR COMPONENT SELECTION Inductor Output Capacitor Inverting Regulator Stability INSULATION LIFETIME Surface Tracking Insulation Wear Out Calculation and Use of Parameters Example THERMAL ANALYSIS TYPICAL APPLICATION CIRCUIT PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE