Datasheet ADP1032 (Analog Devices) - 7

FabricanteAnalog Devices
DescripciónTwo-Channel, Isolated Micropower Management Unit with Seven Digital Isolators
Páginas / Página37 / 7 — Data Sheet. ADP1032. REGULATORY INFORMATION. Table 3. Safety …
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Data Sheet. ADP1032. REGULATORY INFORMATION. Table 3. Safety Certifications UL (Pending). CSA (Pending). VDE (Pending)

Data Sheet ADP1032 REGULATORY INFORMATION Table 3 Safety Certifications UL (Pending) CSA (Pending) VDE (Pending)

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Data Sheet ADP1032 REGULATORY INFORMATION
See Table 9 and the Insulation Lifetime section for the recommended maximum working voltages for specific cross isolation waveforms and insulation levels.
Table 3. Safety Certifications UL (Pending) CSA (Pending) VDE (Pending)
Recognized Under UL 1577 Approved under CSA Component Acceptance Notice 5A Certified according to DIN V VDE V Component Recognition Program 0884-10 (VDE V 0884-10):2006-12 2500 V rms Single Protection CSA 60950-1-07+A1+A2 and IEC 60950-1, second edition, Basic insulation, 565 VPEAK +A1+A2: basic insulation at 300 V rms (424 VPEAK) CSA 61010-1-12 and IEC 61010-1 third edition: basic insulation at 300 V rms mains, 300 V rms (424 VPEAK) secondary
ELECTROMAGNECTIC COMPATIBILITY Table 4. Regulatory Body Standard Comment
SGS-CCSR CISPR11 Class B Pending
INSULATION AND SAFETY RELATED SPECIFICATIONS Table 5. Parameter Symbol Test Conditions/Comments Value Unit
Rated Dielectric Insulation Voltage 1 minute duration 2500 V rms Minimum External Air Gap (Clearance) Field Power Domain to Master Domain Measured from field power pins and pads to master 2.15 mm min pins and pads, shortest distance through air Field Power Domain to Slave Domain Measured from field power pins and pads to slave pins 2.15 mm min and pads, shortest distance through air Master Domain to Slave Domain Measured from master pins and pads to slave pins and 2.15 mm min pads, shortest distance through air Minimum External Tracking (Creepage) Field Power Domain to Master Domain Measured from field power pins and pads to master 2.15 mm min pins and pads, shortest distance path along body Field Power Domain to Slave Domain Measured from field power pins and pads to slave pins 2.15 mm min and pads, shortest distance path along body Master Domain to Slave Domain Measured from master pins and pads to slave pins and 2.15 mm min pads, shortest distance path along body Minimum Internal Gap (Internal Clearance) Insulation distance through insulation 18 µm min Tracking Resistance (Comparative Tracking Index) CTI DIN IEC 112/VDE 0303, Part 1 >400 V Material Group Material group (DIN VDE 0110, 1/89, Table 1) II Rev. 0 | Page 7 of 37 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT COMPANION PRODUCTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS REGULATORY INFORMATION ELECTROMAGNECTIC COMPATIBILITY INSULATION AND SAFETY RELATED SPECIFICATIONS DIN V VDE 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION FLYBACK REGULATOR Flyback Regulator Operation Power Saving Mode (PSM) Flyback Undervoltage Lockout (UVLO) Flyback Regulator Precision Enable Control Flyback Regulator Soft Start Flyback Slew Rate Control Flyback Regulator Overcurrent Protection Flyback Regulator Overvoltage Protection BUCK REGULATOR Buck Regulator Operation Buck Regulator UVLO Buck Regulator Soft Start Buck Regulator Current-Limit Protection Buck Regulator Active Pull-Down Resistor Buck Regulator OVP POWER GOOD POWER-UP SEQUENCE OSCILLATOR AND SYNCHRONIZATION THERMAL SHUTDOWN DATA ISOLATION High Speed SPI Channels GPIO Data Channels APPLICATIONS INFORMATION COMPONENT SELECTION Feedback Resistors Capacitor Selection FLYBACK REGULATOR COMPONENTS SELECTION Input Capacitor Output Capacitor Ripple Current vs. Capacitor Value Schottky Diode Transformer Turn Ratio Primary Inductance Flyback Transformer Saturation Current Series Winding Resistance Leakage Inductance and Clamping Circuits Clamping Resistor Clamping Capacitor Clamping Diode Diode, Zener Diode Clamp Ripple Current (IAC) vs. Inductance Maximum Output Current Calculation BUCK REGULATOR COMPONENTS SELECTION Inductor Output Capacitor INSULATION LIFETIME Surface Tracking Insulation Wear Out Calculation and Use of Parameters Example THERMAL ANALYSIS TYPICAL APPLICATION CIRCUIT PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE