Datasheet LAN9312 (Microchip) - 8
| Fabricante | Microchip |
| Descripción | High Performance Two Port 10/100 Managed Ethernet Switch with 32-Bit Non-PCI CPU Interface |
| Páginas / Página | 8 / 8 |
| Formato / tamaño de archivo | PDF / 298 Kb |
| Idioma del documento | Inglés |
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High Performance Two Port 10/100 Managed Ethernet Switch with 32-Bit Non-PCI CPU Interface Table 2 LAN9312 128-XVTQFP Dimensions
MIN NOMINAL MAX REMARKS A -1.20 Overall Package Height A1 0.05 -0.15 Standoff A2 0.95 1.00 1.05 Body Thickness D/E 15.80 16.00 16.20 X/Y Span D1/E1 13.80 14.00 14.20 X/Y Plastic Body Size D2/E2 6.35 6.50 6.65 X/Y Exposed Pad Size L 0.45 0.60 0.75 Lead Foot Length b 0.13 0.18 0.23 Lead Width c 0.09 -0.20 Lead Foot Thickness e 0.40 BSC Lead Pitch ddd 0.00 -0.07 True Position Spread ccc -0.08 Coplanarity Notes:
1. All dimensions are in millimeters unless otherwise noted.
2.
3.
4.
5. Dimensions b & c apply to the flat section of the lead foot between 0.10 and 0.25mm from the lead tip. The
base metal is exposed at the lead tip.
Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm per side. D1
and E1 are maximum plastic body size dimensions including mold mismatch.
Dimensions D2 and E2 represent the size of the exposed pad. The exposed pad shall be coplanar with the
bottom of the package within 0.05mm.
The pin 1 identifier may vary, but is always located within the zone indicated. Figure 6 LAN9312 128-XVTQFP Recommended PCB Land Pattern Revision 2.0 (02-14-13) 8 PRODUCT PREVIEW SMSC LAN9312
MIN NOMINAL MAX REMARKS A -1.20 Overall Package Height A1 0.05 -0.15 Standoff A2 0.95 1.00 1.05 Body Thickness D/E 15.80 16.00 16.20 X/Y Span D1/E1 13.80 14.00 14.20 X/Y Plastic Body Size D2/E2 6.35 6.50 6.65 X/Y Exposed Pad Size L 0.45 0.60 0.75 Lead Foot Length b 0.13 0.18 0.23 Lead Width c 0.09 -0.20 Lead Foot Thickness e 0.40 BSC Lead Pitch ddd 0.00 -0.07 True Position Spread ccc -0.08 Coplanarity Notes:
1. All dimensions are in millimeters unless otherwise noted.
2.
3.
4.
5. Dimensions b & c apply to the flat section of the lead foot between 0.10 and 0.25mm from the lead tip. The
base metal is exposed at the lead tip.
Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm per side. D1
and E1 are maximum plastic body size dimensions including mold mismatch.
Dimensions D2 and E2 represent the size of the exposed pad. The exposed pad shall be coplanar with the
bottom of the package within 0.05mm.
The pin 1 identifier may vary, but is always located within the zone indicated. Figure 6 LAN9312 128-XVTQFP Recommended PCB Land Pattern Revision 2.0 (02-14-13) 8 PRODUCT PREVIEW SMSC LAN9312