Datasheet KSZ8864CNX, KSZ8864RMNUB (Microchip) - 2

KSZ8864CNX/RMNUB Low-Power Dissipation
• Full-Chip Software Power-Down and Per Port Software Power-Down • Energy-Detect Mode Support <0.1W Full-Chip Power Consumption When All Ports Have No Activity • Very-Low Full-Chip Power Consumption (~0.3W), without Extra Power Consumption on Transformers • Dynamic Clock Tree Shutdown Feature • Voltages: - Analog VDDAT 3.3V Only - VDDIO Support 3.3V, 2.5V, and 1.8V - Low 1.2V Core Power • Commercial Temperature Range: 0°C to +70°C • Industrial Temperature Range: –40°C to +85°C • Automotive AEC-Q100 Grade 3 Temperature Range: –40°C to +85°C • Available in 64-pin QFN, Lead-Free Small Package
Target Applications
• VoIP Phone • Set-Top/Game Box • Automotive Ethernet • Industrial Control • IPTV POF • SOHO Residential Gateway • Broadband Gateway/Firewall/VPN • Integrated DSL/Cable Modem • Wireless LAN Access Point + Gateway • Standalone 10/100 Switch • Embedded System DS00002229D-page 2  2018 Microchip Technology Inc. Document Outline Integrated 4-Port 10/100 Managed Switch with Two MACs MII or RMII Interfaces 1.0 Introduction 1.1 General Description FIGURE 1-1: Functional Diagram 2.0 Pin Description and Configuration FIGURE 2-1: 64-QFN Pin Assignment (TOP View) TABLE 2-1: Signals - KSZ8864CNX/RMNUB TABLE 2-2: Strap-In Options - KSZ8864CNX/RMNUB 3.0 Functional Description 3.1 Physical Layer Transceiver 3.1.1 100BASE-TX Transmit 3.1.2 100BASE-TX Receive 3.1.3 PLL Clock Synthesizer 3.1.4 Scrambler/De-Scrambler (100BASE-TX Only) 3.1.5 10BASE-T Transmit 3.1.6 10BASE-T Receive 3.1.7 MDI/MDI-X Auto Crossover TABLE 3-1: MDI/MDI-X Pin Definitions FIGURE 3-1: Typical Straight Cable Connection FIGURE 3-2: Typical Crossover Cable Connection 3.1.8 Auto-Negotiation FIGURE 3-3: Auto-Negotiation Flow Chart 3.1.9 LinkMD® Cable Diagnostics 3.1.10 On-Chip Termination Resistors 3.2 Power Management TABLE 3-2: Internal Function Block Status 3.2.1 Normal Operation Mode 3.2.2 Energy Detect Mode 3.2.3 Soft Power-Down Mode 3.2.4 Power-Saving Mode 3.2.5 Port-Based Power-Down Mode 3.3 Switch Core 3.3.1 Address Look-Up 3.3.2 Learning 3.3.3 Migration 3.3.4 Aging 3.3.5 Forwarding 3.3.6 Switching Engine 3.3.7 Media Access Control (MAC) Operation 3.3.8 Inter-Packet Gap (IPG) 3.3.9 Back-Off Algorithm 3.3.10 Late Collision 3.3.11 Illegal Frames 3.3.12 Flow Control FIGURE 3-4: Destination Address Look-Up Flow Chart - Stage 1 FIGURE 3-5: Destination Address Resolution Flow Chart - Stage 2 3.3.13 Half-Duplex Back Pressure 3.3.14 Broadcast Storm Protection 3.3.15 MII Interface Operation 3.3.16 Switch MAC3/MAC4 SW3/SW4-MII Interface TABLE 3-3: Switch MAC3 SW3-MII and Mac4 SW4-MII Signals 3.3.17 Switch MAC3/MAC4 SW3/SW4-RMII Interface TABLE 3-4: MAC3 SW3-RMII and MAC4 SW4-RMII Connections 3.4 Advanced Functionality 3.4.1 QoS Priority Support FIGURE 3-6: 802.1p Priority Field Format 3.4.2 Spanning Tree Support 3.4.3 Rapid Spanning Tree Support 3.4.4 Tail Tagging Mode FIGURE 3-7: Tail Tag Frame Format TABLE 3-5: Tail Tag Rules 3.4.5 IGMP Support 3.4.6 Port Mirroring Support 3.4.7 VLAN Support TABLE 3-6: FID+DA Look Up in VLAN Mode TABLE 3-7: FID+SA Look Up in VLAN Mode 3.4.8 Rate Limiting Support 3.4.9 Ingress Rate Limit 3.4.10 Egress Rate Limit 3.4.11 Transmit Queue Ratio Programming 3.4.12 Filtering for Self-Address, Unknown Unicast/Multicast Address and Unknown VID Packet/IP Multicast 3.4.13 Configuration Interface FIGURE 3-8: EEPROM Configuration Timing Diagram 3.4.14 SPI Slave Serial Bus Configuration TABLE 3-8: SPI Connections FIGURE 3-9: SPI Write Data Cycle FIGURE 3-10: SPI Read Data Cycle FIGURE 3-11: SPI Multiple Write FIGURE 3-12: SPI Multiple Read 3.5 MII Management (MIIM) Interface TABLE 3-9: MII Management Frame Format 3.6 Serial Management Interface (SMI) TABLE 3-10: Serial Management Interface (SMI) Frame Format 4.0 Register Descriptions TABLE 4-1: Registers Descriptions 4.1 Global Registers TABLE 4-2: Global Register Descriptions 4.2 Port Registers TABLE 4-3: Port Registers 4.3 Advanced Control Registers TABLE 4-4: Advanced Control Register Descriptions TABLE 4-5: Data Rate Selection in 100BT TABLE 4-6: Data Rate Selection in 10BT 4.4 Static MAC Address Table TABLE 4-7: Format of Static MAC Table for Reads TABLE 4-8: Format of Static MAC Table for Writes 4.5 VLAN Table TABLE 4-9: VLAN Table TABLE 4-10: VLAN ID and Indirect Registers 4.6 Dynamic MAC Address Table TABLE 4-11: Dynamic MAC Address Table 4.7 Management Information Base (MIB) Counters TABLE 4-12: MIB Counters 4.8 MIIM Registers TABLE 4-13: MIIM Registers 5.0 Operational Characteristics 5.1 Absolute Maximum Ratings* 5.2 Operating Ratings*** 6.0 Electrical Characteristics TABLE 6-1: Electrical Characteristics 7.0 Timing Diagrams 7.1 EEPROM Timing FIGURE 7-1: EEPROM Interface Input Receive Timing Diagram FIGURE 7-2: EEPROM Interface Output Transmit Timing Diagram TABLE 7-1: EEPROM Timing Parameters 7.2 MII Timing FIGURE 7-3: MAC Mode MII Timing - Data Received from MII FIGURE 7-4: MAC Mode MII TIming - Data Transmitted from MII TABLE 7-2: MAC Mode MII Timing Parameters FIGURE 7-5: PHY Mode MII Timing - Data Received from MII FIGURE 7-6: PHY Mode MII Timing - Data Transmitted from MII TABLE 7-3: PHY Mode MII Timing Parameters 7.3 RMII Timing FIGURE 7-7: RMII Timing - Data Received from RMII FIGURE 7-8: RMII Timing - Data Transmitted to RMII TABLE 7-4: RMII Timing Parameters 7.4 SPI Timing FIGURE 7-9: SPI Input TiminG FIGURE 7-10: SPI OUTput Timing TABLE 7-5: SPI Timing Parameters 7.5 Auto-Negotiation Timing FIGURE 7-11: Auto-Negotiation Timing TABLE 7-6: Auto-Negotiation Timing Parameters 7.6 MDC/MDIO Timing FIGURE 7-12: MDC/MDIO Timing TABLE 7-7: MDC/MDIO Typical Timing Parameters 7.7 Reset Timing FIGURE 7-13: Reset Timing Diagram TABLE 7-8: Reset Timing Parameters 8.0 Reset Circuit FIGURE 8-1: Recommended Reset Circuit FIGURE 8-2: Recommended Reset Circuit for CPU/FPGA Reset Output 9.0 Selection of Isolation Transformer, (Note 1) TABLE 9-1: Transformer Selection Criteria 9.0.1 Selection of Transformer Vendors TABLE 9-2: Qualified Magnetic Vendors 9.0.2 Selection of Reference Crystal TABLE 9-3: Typical Reference Crystal Characteristics 10.0 Package Outline FIGURE 10-1: 64-Lead QFN 8 mm x 8 mm Package The Microchip WebSite Customer Change Notification Service Customer Support Appendix A: Data Sheet Revision history Product Identification System AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Dallas Detroit Houston, TX Indianapolis Los Angeles Raleigh, NC New York, NY San Jose, CA Canada - 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