Datasheet OP400 (Analog Devices) - 5

Data Sheet OP400 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
θJA is specified for worst-case mounting conditions, that is, θJA is Supply Voltage ±20 V specified for device in socket for CERDIP and PDIP packages; Differential Input Voltage ±30 V θJA is specified for device soldered to printed circuit board for Input Voltage Supply voltage SOIC package. Output Short-Circuit Duration Continuous
Table 5. Thermal Resistance
Storage Temperature Range
Package Type θ
P, Y, S Packages −65°C to +150°C
JA θJC Unit
Lead Temperature (Soldering 60 sec) 300°C 14-Lead Ceramic DIP 94 10 °C/W Junction Temperature (T 14-Lead Plastic DIP 76 33 °C/W J) Range −65°C to +150°C Operating Temperature Range 16-Lead SOIC 88 23 °C/W OP400A −55°C to +125°C OP400E, OP400F −25°C to +85°C
ESD CAUTION
OP400G 0°C to 70°C OP400H −40°C to +85°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Absolute maximum ratings apply to both dice and packaged parts, unless otherwise noted. Rev. I | Page 5 of 15 Document Outline Features Functional Block Diagrams General Description Table of Contents Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Applications Information Dual Low Power Instrumentation Amplifier Bipolar Current Transmitter Differential Output Instrumentation Amplifier Multiple Output Tracking Voltage Reference Outline Dimensions Ordering Guide SMD Parts and Equivalents