Datasheet ADA4522-2-KGD (Analog Devices) - 10
| Fabricante | Analog Devices |
| Descripción | 55 V, EMI Enhanced, Zero Drift, Ultralow Noise, Rail-to-Rail Output Operational Amplifier |
| Páginas / Página | 10 / 10 — ADA4522-2-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.550. 0.627. 0.3048. … |
| Formato / tamaño de archivo | PDF / 240 Kb |
| Idioma del documento | Inglés |
ADA4522-2-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.550. 0.627. 0.3048. 0.6255. 0.9118. 0.78216. 0.70323. 0.1718. 0.21887. 0.9287. 0.2978. 2.220
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ADA4522-2-KGD Known Good Die OUTLINE DIMENSIONS 1.550 0.627 0.627 0.3048 0.6255 8 1 7 0.9118 0.78216 0.70323 0.1718 2 0.21887 0.9287 6 3 0.2978 5 2.220 0.797 4 0.070 × 0.070 (Pads 1-8) TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.61323 A 0.6255 0.61323 2018- 01- 11-
Figure 2. 8-Pad Bare Die [CHIP] (C-8-17) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1470 × 2140 μm Scribe Line Width 80 × 80 μm Die Size 1550 × 2220 μm Thickness 305 μm Backside V− or left floating V Passivation 10 kA high density plasma oxide + 7 kA nitride Not applicable Bond Pads (Minimum) 70 × 70 μm Bond Pad Composition 0.5 Aluminum (Al), copper (Cu) %
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi CEL 9240HF10AK Bonding Method 1 mil gold Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
ADA4522-2-KGD-WP −40°C to +125°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-17 1 Z = RoHS Compliant Part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20268-0-10/19(0)
Rev. 0 | Page 10 of 10 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—5.0 V OPERATION ELECTRICAL CHARACTERISTICS—30 V OPERATION ELECTRICAL CHARACTERISTICS—55 V OPERATION ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 2. 8-Pad Bare Die [CHIP] (C-8-17) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1470 × 2140 μm Scribe Line Width 80 × 80 μm Die Size 1550 × 2220 μm Thickness 305 μm Backside V− or left floating V Passivation 10 kA high density plasma oxide + 7 kA nitride Not applicable Bond Pads (Minimum) 70 × 70 μm Bond Pad Composition 0.5 Aluminum (Al), copper (Cu) %
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi CEL 9240HF10AK Bonding Method 1 mil gold Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
ADA4522-2-KGD-WP −40°C to +125°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-17 1 Z = RoHS Compliant Part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20268-0-10/19(0)
Rev. 0 | Page 10 of 10 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—5.0 V OPERATION ELECTRICAL CHARACTERISTICS—30 V OPERATION ELECTRICAL CHARACTERISTICS—55 V OPERATION ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE