Datasheet TPD7107F (Toshiba) - 8

FabricanteToshiba
DescripciónIntelligent Power Device Silicon Power MOS Integrated Circuit
Páginas / Página34 / 8 — TPD7107F. Figure 7.8 The abnormalities in power supply voltage
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TPD7107F. Figure 7.8 The abnormalities in power supply voltage

TPD7107F Figure 7.8 The abnormalities in power supply voltage

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TPD7107F
Normal UV5 UV3 OV VOV 26V 5.75V V DD VUV5 VUV3 0V VIN V GATE VDIAG T T DIAG LATCH TOV ● VIN: IN pin input voltage ● VGATE: GATE pin output voltage ● VDIAG: DIAG pin output voltage ● VUV3: Low voltage latch threshold ● VUV5: Low voltage detection threshold ● VOV: Over voltage detection voltage ● TDIAG: DIAG clear standby time ● TLATCH: Latch clear standby time ● TOV: Over voltage detection mask time
Figure 7.8 The abnormalities in power supply voltage
© 2 020 8 2020-04-09 Toshiba Electronic Devices & Storage Corporation Document Outline 1. Description 2. Uses 3. Features 4. Block Diagram 5. Pin Assignments 6. Pin Description 7. Operational Description 7.1. Protection for reverse connection of power supply 7.2. Active clamp 7.3. Gate drive of Power MOSFET (Off driver) 7.3.1. Normal off, rapid off 7.3.2. Protection for disconnection of GND terminal 7.4. Load current sense at time of Power MOSFET drive 7.5. The abnormalities in power supply voltage (VDD over voltage, VDD under voltage) 7.6. Over current protection 7.7. Over temperature protection. 7.8. Abnormalities in voltage between Drain and source of the external FET (VDS error) 7.9. Load open / VDD short of load line and diagnosis output 7.10. Truth Table 7.11. State Transition Diagram 8. Absolute Maximum Ratings 8.1. Thermal Resistance 9. Operating Ranges 10. Electrical Characteristics 10.1. Electrical characteristics 1 10.2. Electrical characteristics 2 10.3. Current sense amp Electrical Characteristics 11. Test Circuit 11.1. Test circuit 1 High level output voltage (3) 11.2. Test circuit 2 Switching time (Td-ON, Td-OFF, Tr, Tf) 11.3. Test circuit 3 Off impedance at GND open 11.4. Test circuit 4 Input offset voltage 12. Characteristic curves 13. Package Information 13.1. Package Dimensions 13.2. Marking 13.3. Land Pattern Dimensions for Reference only 14. IC Usage Notes 14.1. Notes on Handling of ICs 14.2. Notes on mounting. RESTRICTIONS ON PRODUCT USE