Datasheet ADT7301 (Analog Devices) - 5

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ADT7301 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress V to GND −0.3 V to +7 V DD rating only; functional operation of the device at these or any Digital Input Voltage to GND −0.3 V to V + 0.3 V DD other conditions above those indicated in the operational Digital Output Voltage to GND −0.3 V to V + 0.3 V DD section of this specification is not implied. Exposure to absolute Operating Temperature Range1 −40°C to +150°C maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Junction Temperature 150°C 6-Lead SOT-23 (RJ-6)
1.2
Power Dissipation2 W = (T max − T 3)/θ MAX J A JA
1.0
Thermal Impedance θ , Junction-to-Ambient 190.4°C/W JA(Still Air)
0.8
8-Lead MSOP (RM-8)
SOT-23
Power Dissipation2 W = (T max − T 3)/θ
0.6
MAX J A JA Thermal Impedance4
0.4 MSOP
θ , Junction-to-Ambient 205.9°C/W JA(Still Air) θ , Junction-to-Case 43.74°C/W
0.2
JC
MAXIMUM POWER DISSIPATION (W)
IR Reflow Soldering Peak Temperature 220°C (0°C/5°C)
0 0 10 20 30 40 50 60 70 80 90 –40 –30 –20 –10 100 110 120 130 140 150
Time at Peak Temperature 10 sec to 20 sec
TEMPERATURE (
°
C)
02884-003 Ramp-Up Rate 3°C/s max Figure 3. Plot of Maximum Power Dissipation vs. Temperature Ramp-Down Rate −6°C/s max Time 25°C to Peak Temperature 6 minutes max IR Reflow Soldering—Pb-Free Package
ESD CAUTION
Peak Temperature 260°C (0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/s max Ramp-Down Rate −6°C/s max Time 25°C to Peak Temperature 8 minutes max 1 It is not recommended to operate the ADT7301 at temperatures above 125°C for greater than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability. 2 Values relate to the package being used on a standard 2-layer PCB. Refer to Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 3 TA = ambient temperature. 4 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted components. Rev. B | Page 5 of 16 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Timing Characteristics Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Converter Details Temperature Value Register Temperature Conversion Equations Serial Interface Read Operation Write Operation Applications Information Microprocessor Interfacing ADT7301-to-MC68HC11 Interface ADT7301-to-8051 Interface ADT7301-to-PIC16C6x/7x Interface ADT7301-to-ADSP-21xx Interface Mounting the ADT7301 Supply Decoupling Outline Dimensions Ordering Guide