Datasheet ADT7310 (Analog Devices) - 5

link to page 5 link to page 5 link to page 5 link to page 5
Data Sheet ADT7310 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any VDD to GND –0.3 V to +7 V other conditions above those indicated in the operational DIN Input Voltage to GND –0.3 V to VDD + 0.3 V section of this specification is not implied. Exposure to absolute DOUT Voltage to GND –0.3 V to VDD + 0.3 V maximum rating conditions for extended periods may affect SCLK Input Voltage to GND –0.3 V to VDD + 0.3 V device reliability. CS Input Voltage to GND –0.3 V to VDD + 0.3 V CT and INT Output Voltage to GND –0.3 V to VDD + 0.3 V
1.2
ESD Rating (Human Body Model) 2.0 kV Operating Temperature Range –55°C to +150°C
) 1.0 (W
Storage Temperature Range –65°C to +160°C
N IO T
Maximum Junction Temperature, TJMAX 150°C
PA 0.8
8-Lead SOIC-N (R-8)
ISSI
Power Dissipation1 W 2
D
MAX = (TJMAX − TA )/θJA
0.6 ER
Thermal Impedance3
W
θJA, Junction-to-Ambient (Still Air) 121°C/W
M PO 0.4
θ
MU
JC, Junction-to-Case 56°C/W
XI
IR Reflow Soldering 220°C
MA 0.2 MAX PD = 3.4mW AT 150°C
Peak Temperature (RoHS- 260°C (0°C) Compliant Package)
0 0
003 Time at Peak Temperature 20 sec to 40 sec
10 20 30 40 50 60 70 80 90 –55 –50 –40 –30 –20 –10 100 110 120 130 140 150 TEMPERATURE (°C)
07789- Ramp-Up Rate 3°C/sec maximum Figure 4. SOIC_N Maximum Power Dissipation vs. Temperature Ramp-Down Rate –6°C/sec maximum Time from 25°C to Peak Temperature 8 minutes maximum
ESD CAUTION
1 Values relate to package being used on a standard 2-layer PCB. This gives a worst-case θJA and θJC. See Figure 4 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted components. Rev. A | Page 5 of 24 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications SPI Timing Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Circuit Information Converter Details Temperature Measurement One-Shot Mode 1 SPS Mode CT and INT Operation in One-Shot Mode Continuous Read Mode Shutdown Fault Queue Temperature Data Format Temperature Conversion Formulas 16-Bit Temperature Data Format 13-Bit Temperature Data Format 10-Bit Temperature Data Format 9-Bit Temperature Data Format Registers Status Register Configuration Register Temperature Value Register ID Register TCRIT Setpoint Register THYST Setpoint Register THIGH Setpoint Register TLOW Setpoint Register Serial Interface SPI Command Byte Writing Data Reading Data Interfacing to DSPs or Microcontrollers Serial Interface Reset INT and CT Outputs Undertemperature and Overtemperature Detection Comparator Mode Interrupt Mode Applications Information Thermal Response Time Supply Decoupling Temperature Monitoring Outline Dimensions Ordering Guide