Datasheet TC78H670FTG (Toshiba) - 4
| Fabricante | Toshiba |
| Descripción | Clock-in and Serial controlled Bipolar Stepping Motor Driver |
| Páginas / Página | 43 / 4 — 5. Block Diagram |
| Formato / tamaño de archivo | PDF / 1.6 Mb |
| Idioma del documento | Inglés |
5. Block Diagram
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TC78H670FTG
5. Block Diagram
AGND VM ０ 1 STBY VREF Regulator UVLO DAC OUT_A+ OUT_A- MODE3 / CW-CCW MODE2 / CLK / S_CLK PGND_A M MODE1 / SET_EN / LATCH Control MODE0 / UP-DW / S_DATA circuit OPD EN / ERR OUT_B+ TSD OUT_B- OSCM OSC ISD PGND_B Note: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. Note: All the grounding wires should be solid patterns and be externally terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation. Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged. Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins (VM, AGND, PGND_x, OUT_x+ and OUT_x- (x = A or B)) through which a particularly large current may run. If these pins are wired incorrectly, an operation error may occur or the device may be destroyed. The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running through the IC that is larger than the specified current. Careful attention should be paid to design patterns and mountings. 4 2019-11-28
5. Block Diagram
AGND VM ０ 1 STBY VREF Regulator UVLO DAC OUT_A+ OUT_A- MODE3 / CW-CCW MODE2 / CLK / S_CLK PGND_A M MODE1 / SET_EN / LATCH Control MODE0 / UP-DW / S_DATA circuit OPD EN / ERR OUT_B+ TSD OUT_B- OSCM OSC ISD PGND_B Note: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. Note: All the grounding wires should be solid patterns and be externally terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation. Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged. Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins (VM, AGND, PGND_x, OUT_x+ and OUT_x- (x = A or B)) through which a particularly large current may run. If these pins are wired incorrectly, an operation error may occur or the device may be destroyed. The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running through the IC that is larger than the specified current. Careful attention should be paid to design patterns and mountings. 4 2019-11-28