Datasheet BCR430UW6 (Diodes) - 3

BCR430UW6 Absolute Maximum Ratings
(Voltage relative to GND, @TA = +25°C, unless otherwise specified.)
Parameter Symbol Min Max Unit
Supply Voltage VS -0.5 45 V Output Current IOUT 0 100 mA Output Voltage VOUT -0.5 42 V REXT Current IREXT 0 0.3 mA REXT Voltage VREXT -0.5 5 V
Recommended Operating Conditions Parameter Symbol Min Max Unit
Supply Voltage VS 5 42 V OUT Pin Voltage Range VOUT 0.5 40 V Output Current (Note 5) IOUT 5 100 mA Ambient Temperature Range (Notes 5 & 6) TA -40 +125 °C Normal Operation Junction Temperature Range TJ -40 +125 °C (Note 6)
Thermal Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
(Note 7) 922 Power Dissipation PD mW (Note 8) 993 (Note 7) 136 Thermal Resistance, Junction to Ambient RθJA (Note 8) 126 °C/W Thermal Resistance, Junction to Lead (Note 9) RθJL 88.5 Operating Junction Temperature TJ -40 +150 °C Recommended Storage Temperature TS -55 +165 °C
ESD Ratings
(Note 10)
Characteristics Symbols Value Unit JEDEC Class
Electrostatic Discharge – Human Body Model HBM 2000 V 2 Charge Device Model CDM 1000 V C5 Notes: 5. Subject to power dissipation and junction temperature not exceeding +125°C; beyond TJ = +100°C the LED current may start to fold back reducing the temperature of both the IC and LEDs. 6. Device will operate with its junction temperature at +125°C, however at this junction temperature the LED current will have been automatically reduced (folded back) from designed (room temperature/+25°C) level. 7. For a device mounted on MRP FR4-PCB; device is measured under still air conditions whilst operating in a steady-state. 8. Same as Note 7, except the device is mounted on 25mm  25mm 2oz copper. 9. RθJL = Thermal resistance from junction to solder-point (at the end of the OUT leads). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. BCR430UW6 3 of 9 October 2019 Datasheet number: DS42214 Rev. 2 - 2
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