Datasheet STPMIC1 (STMicroelectronics) - 7

STPMIC1 Electrical and timing characteristics 3 Electrical and timing characteristics 3.1 Absolute maximum ratings Table 4. Absolute maximum ratings Parameter Min. Unit
VIN, BUCKxIN, SWIN, LDO3IN, LDOxxIN, PONKEYn -0.5 to 6 V VIO, SDA, SCL, RSTn, PWRCTRL, INTn, WAKEUP -0.5 to 4.2 V INTLDO -0.5 to 2 V VLXx -0.5 to 6 V VOUT1, VOUT2 -0.5 to 3 V VOUT3, VOUT4 -0.5 to 5 V BSTOUT, VBUSOTG, VLXBST, SWOUT -0.5 to 6 V LDOxOUT, VREFDDR -0.5 to 5 V TSTO storage temperature -65 to 150 °C ESD human body model ±1000 V ESD charge device model ±500 V Note: Once the normal operating conditions are exceeded, the performance of the device may suffer. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.
3.2 Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Min. Max. Unit
TJ Operating junction temperature -40 125 °C TJAMR Absolute maximum junction temperature -40 160 °C TA Operating ambient temperature -40 105 °C Ѳ Junction-case package thermal resistance JEDEC JC 7 reference (JESD51-12.01) °C/W Ѳ Junction-ambient package thermal resistance on JA 29 2s2p std JEDEC board (JESD51-7)
DS12792
-
Rev 2 page 7/141
Document Outline Features Applications Description 1 Device configuration table 2 Typical application schematic 2.1 Recommended external components 2.2 Pinout and pin description 3 Electrical and timing characteristics 3.1 Absolute maximum ratings 3.2 Thermal characteristics 3.3 Consumption in typical application scenarios 3.4 Electrical and timing parameters 3.5 Application board curves 4 Power regulators and switch description 4.1 Overview 4.2 LDO regulators 4.2.1 LDO regulators - common features 4.2.2 LDO regulators - special features 4.2.3 LDO output voltage settings 4.3 DDR memory sub-system examples 4.3.1 Powering lpDDR2/lpDDR3 memory 4.3.2 Powering DDR3/DDR3L memory 4.4 Buck converters 4.4.1 BUCK general description 4.4.2 BUCK output voltage settings 4.5 Boost converter and power switches 4.5.1 Boost converter 4.5.2 PWR_USB_SW and PWR_SW power switches 4.6 USB sub-system examples 5 Functional description 5.1 Overview 5.2 Functional state machine 5.2.1 Main state machine diagram 5.2.2 State explanations 5.3 POWER_UP, POWER_DOWN sequence 5.4 Feature description 5.4.1 VIN conditions and monitoring 5.4.2 Turn-ON conditions 5.4.3 Turn-OFF conditions and restart_request 5.4.4 Reset and mask_reset option 5.4.5 Power control modes (MAIN / ALTERNATE) 5.4.6 Thermal protection 5.4.7 Overcurrent protection (OCP) 5.4.8 BOOST overvoltage protection 5.4.9 Watchdog feature 5.5 Programming 5.5.1 I2C interface 5.5.2 Non-volatile memory (NVM) 6 Register description 6.1 User register map 6.2 Status registers 6.2.1 Turn-ON status register (TURN_ON_SR) 6.2.2 Turn-OFF status register (TURN_OFF_SR) 6.2.3 Overcurrent protection LDO turn-OFF status register (OCP_LDOS_SR) 6.2.4 Overcurrent protection buck turn-OFF status register (OCP_BUCKS_BSW_SR) 6.2.5 Restart status register (RESTART_SR) 6.2.6 Version status register (VERSION_SR) 6.3 Control registers 6.3.1 Main control register (MAIN_CR) 6.3.2 Pads pull control register (PADS_PULL_CR) 6.3.3 Bucks pull-down control register (BUCKS_PD_CR) 6.3.4 LDO1-4 pull-down control register (LDO14_PD_CR) 6.3.5 LDO5/6 pull-down control register (LDO56_VREF_PD_CR) 6.3.6 PWR_SWOUT and VIN control register (SW_VIN_CR) 6.3.7 PONKEYn turn-OFF control register (PKEY_TURNOFF_CR) 6.3.8 Mask reset Buck control register (BUCKS_MRST_CR) 6.3.9 Mask reset LDO control register (LDOS_MRST_CR) 6.3.10 Watchdog control register (WDG_CR) 6.3.11 Watchdog timer control register (WDG_TMR_CR) 6.3.12 Bucks OCP turn-OFF control register (BUCKS_OCPOFF_CR) 6.3.13 LDO OCP turn-OFF control register (LDOS_OCPOFF_CR) 6.4 Power supplies control registers 6.4.1 BUCKx MAIN mode control registers (BUCKx_MAIN_CR) (x=1…4) 6.4.2 REFDDR MAIN mode control register (REFDDR_MAIN_CR) 6.4.3 LDOx MAIN mode control registers (LDOx_MAIN_CR) (x=1, 2, 5, 6) 6.4.4 LDO3 MAIN mode control register (LDO3_MAIN_CR) 6.4.5 LDO4 MAIN mode control register (LDO4_MAIN_CR) 6.4.6 BUCKx ALTERNATE mode control registers (BUCKx_ALT_CR)(x=1..4) 6.4.7 REFDDR ALTERNATE mode control register (REFDDR_ALT_CR) 6.4.8 LDOx ALTERNATE mode control registers (LDOx_ALT_CR) (x=1, 2, 5, 6) 6.4.9 LDO3 ALTERNATE mode control register (LDO3_ALT_CR) 6.4.10 LDO4 ALTERNATE mode control register (LDO4_ALT_CR) 6.4.11 Boost/switch control register (BST_SW_CR) 6.5 Interrupt registers 6.5.1 Overall interrupt register behavior 6.5.2 Interrupt pending register 1 (INT_PENDING_R1) 6.5.3 Interrupt pending register 2 (INT_PENDING_R2) 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) 6.5.6 Interrupt debug latch registers (INT_DBG_LATCH_Rx) 6.5.7 Interrupt clear registers (INT_CLEAR_Rx) 6.5.8 Interrupt mask registers (INT_MASK_Rx) 6.5.9 Interrupt set mask registers (INT_SET_MASK_Rx) 6.5.10 Interrupt clear mask registers (INT_CLEAR_MASK_Rx) 6.5.11 Interrupt source register 1 (INT_SRC_R1) 6.5.12 Interrupt source register 2 (INT_SRC_R2) 6.5.13 Interrupt source register 3 ( INT_SRC_R3) 6.5.14 Interrupt source register 4 ( INT_SRC_R4) 6.6 NVM registers 6.6.1 NVM status register (NVM_SR) 6.6.2 NVM control register (NVM_CR) 6.7 NVM shadow registers 6.7.1 NVM main control shadow register (NVM_MAIN_CTRL_SHR) 6.7.2 NVM BUCK rank shadow register (NVM_BUCKS_RANK_SHR) 6.7.3 NVM LDOs rank shadow register 1 (NVM_LDOS_RANK_SHR1) 6.7.4 NVM LDOs rank shadow register 2 (NVM_LDOS_RANK_SHR2) 6.7.5 NVM BUCKs voltage output shadow register (NVM_BUCKS_VOUT_SHR) 6.7.6 NVM LDOs voltage output shadow register 1 (NVM_LDOS_VOUT_SHR1 6.7.7 NVM LDOs voltage output shadow register 2 (NVM_LDOS_VOUT_SHR2) 6.7.8 NVM device address shadow register (I2C_ADDR_SHR) 7 Package information 7.1 WFQFN 44L (5X6X0.8) package information 8 Marking composition 9 Ordering information Revision history