Datasheet PCMFxUSB3BA/C (Nexperia) - 6

FabricanteNexperia
DescripciónCommon-mode EMI filter for differential channels with integrated bidirectional ESD protection
Páginas / Página15 / 6 — Nexperia. PCMFxUSB3BA/C series
Revisión14082019
Formato / tamaño de archivoPDF / 857 Kb
Idioma del documentoInglés

Nexperia. PCMFxUSB3BA/C series

Nexperia PCMFxUSB3BA/C series

Línea de modelo para esta hoja de datos

Versión de texto del documento

Nexperia PCMFxUSB3BA/C series Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
aaa-029774 25 aaa-029775 0 I I (A) (A) 20 -5 15 -10 10 -15 5 -20 0 -25 0 4 8 12 16 -16 -12 -8 -4 0 VCL (V) VCL (V) Transmission Line Pulse (TLP) = 100 ns; Transmission Line Pulse (TLP) = 100 ns; measured CH_IN to GND measured CH_IN to GND
Fig. 5. Dynamic resistance with positive clamping; Fig. 6. Dynamic resistance with negative clamping; typical values typical values
aaa-029776 60 aaa-029777 0 I I (A) (A) 40 -20 20 -40 0 -60 0 10 20 30 -30 -20 -10 0 VCL (V) VCL (V) Very-Fast Transmission Line Pulse Very-Fast Transmission Line Pulse (VF-TLP) = 5 ns; (VF-TLP) = 5 ns; measured CH_IN to GND measured CH_IN to GND
Fig. 7. Dynamic resistance with positive clamping; Fig. 8. Dynamic resistance with negative clamping; typical values typical values
The device uses an advanced clamping structure showing a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage (due to an ESD pulse for instance). PCMFXUSB3BA_C_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. Al rights reserved
Product data sheet Rev. 2 — 14 August 2019 6 / 15
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Pinning information 5. Ordering information 6. Marking 7. Limiting values 8. Characteristics 8.1. Channel characteristics 8.2. Frequency characteristics 9. Application information 10. Package outline 11. Soldering 12. Revision history Contents