Datasheet MCP616, MCP617, MCP618, MCP619 (Microchip)

MCP616/7/8/9 2.3V to 5.5V Micropower Bi-CMOS Op Amps Features Description
• Low Input Offset Voltage: ±150 µV (maximum) The MCP616/7/8/9 family of operational amplifiers (op • Low Noise: 2.2 µV amps) from Microchip Technology Inc. are capable of P-P (typical, 0.1 Hz to 10 Hz) • Rail-to-Rail Output precision, low-power, single-supply operation. These op amps are unity-gain stable, have low input offset • Low Input Offset Current: 0.3 nA (typical) voltage (±150 µV, maximum), rail-to-rail output swing • Low Quiescent Current: 25 µA (maximum) and low input offset current (0.3 nA, typical). These • Power Supply Voltage: 2.3V to 5.5V features make this family of op amps well suited for • Unity Gain Stable battery-powered applications. • Chip Select (CS) Capability: MCP618 The single MCP616, the single MCP618 with Chip • Industrial Temperature Range: -40°C to +85°C Select (CS) and the dual MCP617 are all available in • No Phase Reversal standard 8-lead PDIP, SOIC and MSOP packages. The • Available in Single, Dual and Quad Packages quad MCP619 is offered in standard 14-lead PDIP, SOIC and TSSOP packages. All devices are fully specified from -40°C to +85°C, with power supplies
Typical Applications
from 2.3V to 5.5V. • Battery Power Instruments • Weight Scales
Package Types
• Strain Gauges
MCP616 MCP617
• Medical Instruments PDIP, SOIC, MSOP PDIP, SOIC, MSOP • Test Equipment NC 1 8 NC V 1 8 V OUTA DD V 2 7 V V 2 7 V
Design Aids
IN– DD INA– OUTB VIN+ 3 6 VOUT VINA+ 3 6 VINB– • SPICE Macro Models VSS 4 5 NC VSS 4 5 VINB+ • Microchip Advanced Part Selector (MAPS) • Mindi™ Circuit Designer & Simulator
MCP618 MCP619
PDIP, SOIC, MSOP PDIP, SOIC, TSSOP • Analog Demonstration and Evaluation Boards • Application Notes NC 1 8 CS V 1 14 OUTA VOUTD VIN– 2 7 VDD VINA– 2 13 VIND–
Input Offset Voltage
VIN+ 3 6 VOUT VINA+ 3 12 VIND+ VSS 4 5 NC VDD 4 11 VSS
s 14%
VINB+ 5 10 VINC+
ce 598 Samples 12% V
V 6 9 V
DD = 5.5V
INB– INC–
rren u 10%
VOUTB 7 8 VOUTC
cc 8% f O 6% e o g ta 4% en 2% erc P 0% 0 0 0 0 0 0 0 -8 -6 -4 -2 20 40 60 80 -10 10 Input Offset Voltage (µV)
 2019 Microchip Technology Inc. DS20001613D-page 1 Document Outline 2.3V to 5.5V Micropower Bi-CMOS Op Amps Features Typical Applications Design Aids Input Offset Voltage Description Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings † DC Electrical Characteristics AC Electrical Characteristics MCP618 Chip Select (CS) Electrical Characteristics FIGURE 1-1: Timing Diagram for the CS Pin on the MCP618. Temperature Characteristics 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage at VDD = 5.5V. FIGURE 2-2: Input Offset Voltage at VDD = 2.3V. FIGURE 2-3: Input Bias Current at VDD = 5.5V. FIGURE 2-4: Input Offset Voltage Drift at VDD = 5.5V. FIGURE 2-5: Input Offset Voltage Drift at VDD = 2.3V. FIGURE 2-6: Input Offset Current at VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Ambient Temperature. FIGURE 2-8: Quiescent Current vs. Ambient Temperature. FIGURE 2-9: Maximum Output Voltage Swing vs. Ambient Temperature at RL = 5 kW. FIGURE 2-10: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Maximum Output Voltage Swing vs. Ambient Temperature at RL = 25 kW. FIGURE 2-13: Output Short Circuit Current vs. Ambient Temperature. FIGURE 2-14: Slew Rate vs. Ambient Temperature. FIGURE 2-15: Input Bias, Offset Currents vs. Common-mode Input Voltage. FIGURE 2-16: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-17: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-18: Input Offset Voltage vs. Output Voltage. FIGURE 2-19: Quiescent Current vs. Power Supply Voltage. FIGURE 2-20: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-21: Gain-Bandwidth Product, Phase Margin vs. Load Resistance. FIGURE 2-22: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-23: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-24: Channel-to-Channel Separation vs. Frequency (MCP617 and MCP619 only). FIGURE 2-25: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-26: Input Noise Voltage, Current Densities vs. Frequency. FIGURE 2-27: Small-Signal, Non-Inverting Pulse Response. FIGURE 2-28: CMRR, PSRR vs. Frequency. FIGURE 2-29: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-30: Small-Signal, Inverting Pulse Response. FIGURE 2-31: Large-Signal, Non-Inverting Pulse Response. FIGURE 2-32: Chip Select (CS) to Amplifier Output Response Time (MCP618 only). FIGURE 2-33: The MCP616/7/8/9 Show No Phase Reversal. FIGURE 2-34: Large-Signal, Inverting Pulse Response. FIGURE 2-35: Chip Select (CS) Internal Hysteresis (MCP618 only). FIGURE 2-36: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input (CS) 3.4 Power Supply Pins (VDD, VSS) 4.0 Applications Information 4.1 Rail-to-Rail Inputs Phase Reversal Input Voltage and Current Limits FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. Normal Operation 4.2 DC Offsets FIGURE 4-3: Example Circuit for Calculating DC Offset. FIGURE 4-4: Equivalent DC Circuit. EQUATION 4-1: 4.3 Rail-to-Rail Output 4.4 Capacitive Loads FIGURE 4-5: Output Resistor, RISO stabilizes large capacitive loads. FIGURE 4-6: Recommended RISO Values for Capacitive Loads. 4.5 MCP618 Chip Select (CS) 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-7: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-8: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-9: High Gain Pre-amplifier. FIGURE 4-10: Two-Op Amp Instrumentation Amplifier. FIGURE 4-11: Three-Op Amp Instrumentation Amplifier. FIGURE 4-12: Precision Gain with Good Load Isolation. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 Mindi™ Circuit Designer & Simulator 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service