MIC9205-Lead SC70 (C5) Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006268A-page 18 2019 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service