Datasheet TB67B000HG (Toshiba) - 8

TB67B000HG
Package Power Dissipation
PD MAX – Ta 40 ① 30 MAX (W) D 20 ation P dissip 10 ② Power ③ ④ 0 0 25 50 75 100 125 150 Ambient temperature Ta (°C) ① INFINITE HEAT SINK : Rθj-c = 1°C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : Rθj-a = 17°C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : Rθj-a = 35°C/W ④ IC only : Rθj-a = 53°C/W 8 2013-5-9 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) Features Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings (Ta = 25°C) Operating conditions (Ta = 25°C) Package Power Dissipation Electrical Characteristics (Ta = 25°C) Functional Description Timing Chart of FG Signal Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit External Parts Package Dimensions