Datasheet TB67B000AHG (Toshiba) - 8
| Fabricante | Toshiba |
| Descripción | Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP). High voltage 3-Phase Full-Wave PWM Brushless Motor Driver |
| Páginas / Página | 31 / 8 — Power Dissipation |
| Formato / tamaño de archivo | PDF / 460 Kb |
| Idioma del documento | Inglés |
Power Dissipation
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TB67B000AHG
Power Dissipation
PD MAX – Ta 40 ) ① (W X 30 MA D P 20 ion at ip s s di 10 er ② ow ③ P ④ 0 0 25 50 75 100 125 150 Ambient temper ature Ta (°C) ① INFINITE HEAT SINK : Rθj-c = 1°C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : Rθj-a = 17°C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : Rθj-a = 35°C/W ④ IC only : Rθj-a = 53°C/W 8 2019-05-30 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) High voltage 3-Phase Full-Wave PWM Brushless Motor Driver Features Block Diagram Pin Assignment Pin Description Input/Output Equivalent Circuits Absolute Maximum Ratings (Ta = 25 C) Operating conditions (Ta = 25 C) Power Dissipation Electrical Characteristics (Ta = 25 C) Functional Description 1. Basic Operation 2. Voltage Command (VSP) Signal and Bootstrap Voltage Regulation 3. Dead Time Insertion (cross conduction protection) 4. Lead Angle Control 5. PWM Carrier Frequency 6. Position Detecting Pin <Hall device input> <Hall IC input> 7. Rotating Pulse Output Timing Chart of FG Signal 8. Protection-related Functions 9. Motor-lock detection Timing Chart Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit Example External Parts Package Dimensions Notes on Contents IC Usage Considerations Notes on handling of ICs PD MAX – Ta 40 Power dissipation PD MAX (W) 30 20 10 0 0 25 50 75 100 125 150 Ambient temperature Ta ( C) ① INFINITE HEAT SINK : R(j-c = 1 C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : R(j-a = 17 C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : R(j-a = 35 C/W ④ IC only : R(j-a = 53 C/W PWM Duty (1) (2) (3) 92% 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V (1) (2) (3) 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V PWM Duty (Upper phase) *95% (typ.) *2.4% (typ.) RESTRICTIONS ON PRODUCT USE
Power Dissipation
PD MAX – Ta 40 ) ① (W X 30 MA D P 20 ion at ip s s di 10 er ② ow ③ P ④ 0 0 25 50 75 100 125 150 Ambient temper ature Ta (°C) ① INFINITE HEAT SINK : Rθj-c = 1°C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : Rθj-a = 17°C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : Rθj-a = 35°C/W ④ IC only : Rθj-a = 53°C/W 8 2019-05-30 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) High voltage 3-Phase Full-Wave PWM Brushless Motor Driver Features Block Diagram Pin Assignment Pin Description Input/Output Equivalent Circuits Absolute Maximum Ratings (Ta = 25 C) Operating conditions (Ta = 25 C) Power Dissipation Electrical Characteristics (Ta = 25 C) Functional Description 1. Basic Operation 2. Voltage Command (VSP) Signal and Bootstrap Voltage Regulation 3. Dead Time Insertion (cross conduction protection) 4. Lead Angle Control 5. PWM Carrier Frequency 6. Position Detecting Pin <Hall device input> <Hall IC input> 7. Rotating Pulse Output Timing Chart of FG Signal 8. Protection-related Functions 9. Motor-lock detection Timing Chart Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit Example External Parts Package Dimensions Notes on Contents IC Usage Considerations Notes on handling of ICs PD MAX – Ta 40 Power dissipation PD MAX (W) 30 20 10 0 0 25 50 75 100 125 150 Ambient temperature Ta ( C) ① INFINITE HEAT SINK : R(j-c = 1 C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : R(j-a = 17 C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : R(j-a = 35 C/W ④ IC only : R(j-a = 53 C/W PWM Duty (1) (2) (3) 92% 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V (1) (2) (3) 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V PWM Duty (Upper phase) *95% (typ.) *2.4% (typ.) RESTRICTIONS ON PRODUCT USE